Thermal and optical properties of COB type LED module based on Al2O3 and AIN ceramic submounts

被引：5

作者：

Kim J.S. ^{[1
]}

Jeon S.L. ^{[2
]}

Le D.W. ^{[3
]}

Son J.H. ^{[4
]}

Lee S.M. ^{[5
]}

Joo Y.-G. ^{[6
]}

Park L.S. ^{[1
,5
]}

机构：

[1] Sensor and Display Engineering, Graduate School, Kyungpook National University, Daegu

[2] Danotech Co. Ltd

[3] Phoenix pde Co. Ltd

[4] Mobile Display Research Center, Kyungpook National University, Daegu

[5] Department of Physics Education, Kyungpook National University, Daegu

来源：

Journal of Applied Sciences | 2010年 / 10卷 / 24期

关键词：

Ceramic; Chip onboard; Encapsulation; Light emitting diode; Module;

D O I：

10.3923/jas.2010.3388.3391

中图分类号：

学科分类号：

摘要：

High power and high brightness light emitting diodes are penetrating into a number of lighting applications due to their excellent color saturation and long life characteristics. In this study, we used Aluminum Oxide (Al2O3) and Aluminum Nitride (AIN) as submount of LED chips and made Chip On Board (COB) type LED module utilizing eutectic bonder. The COB type LED module was made by using metal core printed circuit board and the flipchip on which metal solder was coated. We also fabricated COB type LED modules with epoxy and silicone resins as encapsulant, Al2O3 and AIN as substrates utilizing eutectic and epoxy die bonding methods. In these experiments the effect of AIN substrate was larger than other parameters for high power operation of LED modules. © 2010 Asian Network for Scientific Information.

引用

页码：3388 / 3391

页数：3

共 7 条

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