Failure analysis of lead-free solder joints of an 1657CCGA (ceramic column grid array) package

被引：0

作者：

Agilent, 5301 Steve Creek Boulevard, Santa Clara, CA 95052 ^{[1
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机构：

[1] Agilent, Santa Clara, CA 95052

[2] Flextronics, Youngsville, NC 27596

[3] Flextronics, San Jose, CA 95131

[4] Agilent, Fort Collins, CO 80525

[5] Alcatel, Piano, TX 75075

[6] Celestica, Kidsgrove

[7] Sun Microsystems, Menlo Park, CA 94025

[8] IBM, Endicott, NY 13760

[9] HDPUG, Scottsdale, AZ 85253

来源：

J. Microelectron. Electron. Packag. | 2007年 / 3卷 / 112-120期

关键词：

Failure analysis; Lead-free; Solder joints;

D O I：

10.4071/1551-4897-4.3.112

中图分类号：

学科分类号：

摘要：

In this study, failure analysis of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with the Entek OSP (organic solderability preservative) surface finish is investigated. Emphasis is placed on determining the failure locations and failure modes of the solder joints of the 1657CCGA assemblies after they have been through 7,000 cycles of temperature cycling. © International Microelectronics And Packaging Society - JMEP.

引用

页码：112 / 120

页数：8

共 13 条

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