Development on thermal contact resistance

被引：0
作者：
Zhang, Ping [1 ]
Xuan, Yimin [1 ]
Li, Qiang [1 ]
机构：
[1] School of Energy and Power Engineering, Nanjing University of Science and Technology, Nanjing 210094, Jiangsu
来源：
Huagong Xuebao/CIESC Journal | 2012年 / 63卷 / 02期
关键词：
Electronics heat dissipating; Micro-scale heat transfer theory; Thermal contact conductance; Thermal contact resistance;
D O I：
10.3969/j.issn.0438-1157.2012.02.001
中图分类号：
学科分类号：
摘要：
Thermal contact resistance (TCR) is a hot topic in electronics cooling, cryogenic superconducting thin films, etc. In this paper, the fundamental research method, metrology macro- and nanotechnology, and diminishing method for TCR are reviewed. In order to investigate the heat transfer mechanism of TCR, the scattering and radiation of phonon and electron should be considered besides the quantitative analysis in macro. For the experimental measurement, the accuracy is to be further improved. For reducing the contact resistance, in addition to the commonly used methods, producing new materials with high thermal conductivity (such as carbon nano-tubes) on the contact surface is a useful way. Based on the reported studies, the future researches are discussed. © All Rights Reserved.
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页码：335 / 349
页数：14
相关论文
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