W-Band Compact Triple-Mode Bandpass Filter Using Multistub Resonator in 65-nm CMOS Technology

被引:4
作者
Lu, Qijun [1 ]
Sun, Jiawei [1 ]
Zhang, Hao [2 ]
Zhang, Tao [1 ]
Zhu, Zhangming [1 ]
机构
[1] Xidian Univ, Sch Integrated Circuits, Key Lab Analog Integrated Circuits, Xian 710071, Peoples R China
[2] Nanjing Res Inst Elect Technol, Nanjing 210013, Peoples R China
来源
IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS | 2024年 / 34卷 / 12期
基金
中国国家自然科学基金;
关键词
Band-pass filters; Filters; Impedance; Transmission line measurements; Resonant frequency; Wideband; System-on-chip; Wireless communication; Insertion loss; CMOS technology; Bandpass filter (BPF); symmetrical open stub pair (SOSP); T-shaped stepped impedance stub (TSIS); triple-mode resonator; W; -band; DESIGN; GHZ;
D O I
10.1109/LMWT.2024.3472218
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter presents a novel W-hand compact wideband triple-mode bandpass filter (BPF) using multistub resonator. The resonator is loaded both by T-shaped stepped impedance stub (ISIS) and symmetrical open stub pair (SOSP) to generate three resonant modes and two transmission zeros for improving the bandwidth and enhancing the stopband rejection ability. Moreover, the characteristic admittance ratio has the ability to flexibly adjust the bandwidth and the transmission zero. The proposed BPF is fabricated in 65-nm CMOS technology with a core area of 444 x 192 mu m(2). The measurement results show that the 3-dB bandwidth is 30.7 GHz at the center frequency of 94 GHz, the minimum insertion loss is 4.3 dB, and the stopband 2 Al rejection is better than 20 dB.
引用
收藏
页码:1319 / 1322
页数:4
相关论文
共 24 条
[1]   A Tunable D-Band Filter Based on MOSCAP in 65nm CMOS Technology [J].
Bahrami, Sirous ;
Lee, Kangseop ;
Song, Ho-Jin .
IEEE ACCESS, 2023, 11 :26785-26792
[2]   A Broadside-Coupled Meander-Line Resonator in 0.13-μm SiGe Technology for Millimeter-Wave Application [J].
Chakraborty, Sudipta ;
Yang, Yang ;
Zhu, Xi ;
Sevimli, Oya ;
Xue, Quan ;
Esselle, Karu ;
Heimlich, Michael .
IEEE ELECTRON DEVICE LETTERS, 2016, 37 (03) :329-332
[3]   Compact Millimeter-Wave CMOS Bandpass Filters Using Grounded Pedestal Stepped-Impedance Technique [J].
Chang, Shuen-Chien ;
Chen, Yi-Ming ;
Chang, Sheng-Fuh ;
Jeng, Yng-Huey ;
Wei, Chia-Liang ;
Huang, Chun-Hao ;
Jeng, Chih-Pin .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2010, 58 (12) :3850-3858
[4]   A W-Band Compact Substrate Integrated Waveguide Bandpass Filter With Defected Ground Structure in CMOS Technology [J].
Chen, Baichuan ;
Thapa, Samundra K. ;
Barakat, Adel ;
Pokharel, Ramesh K. .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2022, 69 (03) :889-893
[5]   A W-Band 0.01 mm2 Cavity Resonator Employing Slot-Loaded Shielded Folded Ridged Quarter-Mode in CMOS Technology [J].
Chen, Baichuan ;
Thapa, Samundra K. ;
Barakat, Adel ;
Pokharel, Ramesh K. .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2022, 32 (02) :113-116
[6]   High-Performance Shielded Coplanar Waveguides for the Design of CMOS 60-GHz Bandpass Filters [J].
Franc, Anne-Laure ;
Pistono, Emmanuel ;
Gloria, Daniel ;
Ferrari, Philippe .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2012, 59 (05) :1219-1226
[7]   A Compact and Low-Loss Bandpass Filter Using Self-Coupled Folded-Line Resonator With Capacitive Feeding Technique [J].
Hou, Zhang Ju ;
Yang, Yang ;
Zhu, Xi ;
Li, Yuan Chun ;
Dutkiewicz, Eryk ;
Xue, Quan .
IEEE ELECTRON DEVICE LETTERS, 2018, 39 (10) :1584-1587
[8]   Millimeter-Wave Bandpass Filter Based on Spiral Resonators and DGS Using SiGe BiCMOS Technology [J].
Liu, Yiqun ;
Weng, Xiaoyu ;
Xu, Kai-Da .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2023, 70 (07) :2385-2389
[9]   Millimeter-Wave Bandpass Filters Using On-Chip Dual-Mode Resonators in 0.13-μm SiGe BiCMOS Technology [J].
Liu, Yiqun ;
Xu, Kai-Da .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2023, 71 (08) :3650-3660
[10]   Compact Size On-Chip 60 GHz H-Shaped Resonator BPF [J].
Mahmoud, Nessim ;
Barakat, Adel ;
Abdel-Rahman, Adel B. ;
Allam, Ahmed ;
Pokharel, Ramesh K. .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2016, 26 (09) :681-683