No waste: Beyond PCBs in reflow profiling

被引：0

作者：

O'Leary, Brian ^{[1
]}

机构：

[1] KIC, 16120 Bernardo Center Dr., San Diego, CA 92127, United States

来源：

SMT Surface Mount Technology Magazine | 2009年 / 23卷 / 05期

关键词：

Printed circuit boards - Application programs;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The correct method for reflow oven set up with a new application is to profile the PCB (printed circuit board) and dial the processed deep in-spec using prediction software. Oven-inherent programming produces an in-spec recipe in the vast majority of the situations with no need to profile or sacrifice a circuit board. This technology also saves set up time and associated labor. There are several TC attachment solutions, some more destructive to the PCB assembly than others. The use of high temperature solder wire is a reliable method, but tends to damage the PCB assembly. Aluminum tape is also a reliable and repeatable method with the added benefit that the tape can be removed after the profile without damaging components.

引用