Cold embossing of ceramic green tapes

被引：2
|
作者：
Härtel, Anja [1 ]
Richter, Hans-Jürgen [1 ]
Moritz, Tassilo [1 ]
机构：
[1] Fraunhofer Institute of Ceramic Technologies and Systems, Dresden Winterbergstr. 28, 01277 Dresden, Germany
来源：
Journal of Microelectronics and Electronic Packaging | 2012年 / 9卷 / 03期
关键词：
D O I：
10.4071/imaps.337
中图分类号：
学科分类号：
摘要：
引用
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页码：138 / 143
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