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- [1] Ball bumping and coining operations for TAB and Flip Chip 47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 265 - 267
- [2] Ball bumping and coining operations for tab and flip chip 3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS, 1997, : 110 - 112
- [3] Ball bumping and coining operations for tab and flip chip Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 1997, : 110 - 112
- [4] Micro-ball wafer bumping for flip chip interconnection 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 957 - 964
- [5] Design and control of horizontal extension for gold bumping FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS, 2003, : 105 - 109
- [6] An application of micro-ball wafer bumping to double ball bump for flip chip interconnection 55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 855 - 860
- [7] A low cost bumping process for flip chip-technology using electroless nickel bumping and solder ball placement 1ST 1997 IEMT/IMC SYMPOSIUM, 1997, : 174 - 181
- [9] Group Supplier Selection for Multiple-Line Gold Bumping Processes IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (10): : 1576 - 1581