共 14 条
- [1] Approach with Large Panel Fan-Out Technology 2024 International Conference on Electronics Packaging, ICEP 2024, 2024, : 175 - 176
- [2] Stress and Reliability of Underfills in Heterogeneous Integration Fan-Out Multichip Module Packages 2023 International Conference on Electronics Packaging, ICEP 2023, 2023, : 235 - 236
- [3] Post-Buckling Analysis for Addressing Asymmetric Warping of Fan-Out Reconstitution Process 2023 International Conference on Electronics Packaging, ICEP 2023, 2023, : 265 - 266
- [4] Stress and Reliability Challenges of Underfills in Large-Size Fan-Out Multichip Module Packages 2022 International Conference on Electronics Packaging, ICEP 2022, 2022, : 225 - 226
- [5] Micro Ball Mount Process for High Performance Fan-Out Large Panel Level Packaging Back-end Process 2023 International Conference on Electronics Packaging, ICEP 2023, 2023, : 65 - 66
- [6] High Speed Signal Design on Fan-Out RDL Interposer for Artificial Intelligence (AI) and Deep Neural Network (DNN) Chiplet Accelerators Application 2024 International Conference on Electronics Packaging, ICEP 2024, 2024, : 275 - 276
- [7] A Low-Profile, Scalable 28-GHz Phased Array Antenna in Fan-Out Wafer-Level Package for 5G Communication Asia-Pacific Microwave Conference Proceedings, APMC, 2022, 2022-November : 359 - 361
- [8] Numerical Study of Fan Coil Heat Exchanger with Copper-Foam International Journal of Fluid Machinery and Systems, 2023, 16 (01): : 73 - 88
- [9] How annotations are used in Java: An empirical study SEKE - Proc. Int. Conf. Softw. Eng. Knowl. Eng., (426-431):