Micro flat heat pipes for microelectronics cooling: Review

被引：13
作者：
机构：
[1] College of Physics, University of Chinese Academy Sciences, Shijingshan District, Beijing 100049
[2] Laboratory of Advanced Thermal Management Technologies, College of Physics, University of Chinese Academy Sciences, Shijingshan District, Beijing 100049
来源：
Li, J. (jili@ucas.ac.cn) | 1600年 / Bentham Science Publishers卷 / 06期
关键词：
Electronics cooling; High heat flux; Micro flat heat pipe; Modeling; Novel designs; Wick structure;
D O I：
10.2174/22127976113066660011
中图分类号：
学科分类号：
摘要：
A review of recent patents and academic articles on micro flat heat pipes over the past decade is presented herein. Firstly, the development history of the mathematical models of the micro flat heat pipes is chronologically summarized. Then, some major investigations in the micro flat heat pipes, both experimental and theoretical, are summed up. Besides, some innovative ideas and novel micro flat heat pipe designs for particular applications are also documented along with comparisons and discussion on various cross-sectional shapes and designs of wick structure, such as grooves, sintered powders, nanotubes and their combinations. Finally, the challenges in the research of micro flat heat pipes are discussed briefly and the development tendency is prospected according to the existing achievements. © 2013 Bentham Science Publishers.
引用
收藏
页码：169 / 184
页数：15
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