High density RF interconnect

被引:0
|
作者
机构
来源
Microwave Journal | 2007年 / 50卷 / 10期
关键词
The HDRFI™ is a Tensolite patented high frequency connection system that transfers high frequency signals through a unique planar interface. the planar interface removes the need for typical pin and socket connections by utilizing a z-axis elastomer to provide the electrical path between the mated connectors. HDRFI is available only as an assembly in three product lines that includes RF D-Sub; RF Circular; Mixed Signal and in custom applications. The RF-Sub connector family is available in four different shell sizes and can be used in cable-to-cable; cable-to-board or board-to-board applications. The RF Circular connector family is designed for high performance applications. The insert arrangements have been designed to maximize the number of size 16 RF contacts available in a standard circular connector arrangement. The product line consists of shell sizes 15 to 25 and is based on the D38999 Series III specification;
D O I
暂无
中图分类号
学科分类号
摘要
Journal article (JA)
引用
收藏
页码:198 / 200
相关论文
共 50 条
  • [31] HIGH-DENSITY LASER LINKING OF METAL INTERCONNECT
    BERNSTEIN, JB
    VENTURA, TM
    RADOMSKI, AT
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1994, 17 (04): : 590 - 593
  • [32] High density interconnect for polymer based ultrasound transducers
    Gregory, CM
    Carey, SJ
    Hatfield, JV
    Brewin, MP
    Birch, MJ
    2004 IEEE Ultrasonics Symposium, Vols 1-3, 2004, : 2215 - 2218
  • [33] Successful transferring of active transistors, RF-passive components and high density interconnect from bulk Si to organic substrates
    Guo, LH
    Zhang, QX
    Li, HY
    Liao, EB
    Bera, LK
    Loh, WY
    Kuo, CC
    Lo, GQ
    Balasubramanian, N
    Kwong, DL
    IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST, 2005, : 691 - 694
  • [34] HIGH-DENSITY RF CONFINEMENT
    PROBERT, PH
    SHOHET, JL
    BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1977, 22 (09): : 1134 - 1134
  • [35] Embedded Multidie Interconnect Bridge-A Localized, High-Density Multichip Packaging Interconnect
    Mahajan, Ravi
    Qian, Zhiguo
    Viswanath, Ram S.
    Srinivasan, Sriram
    Aygun, Kemal
    Jen, Wei-Lun
    Sharan, Sujit
    Dhall, Ashish
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (10): : 1952 - 1962
  • [36] Photo patterned conductors with LTCC for microwave and high density interconnect
    Barnwell, P
    Smith, B
    Ehlert, M
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 149 - 154
  • [37] Novel polymer dielectrics for wafer level high density interconnect
    Yokotsuka, Shunsuke
    6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Proceedings 2007, 2007, : 287 - 289
  • [38] HIGH-DENSITY INTERCONNECT OVERLAY FOR BARE CHIP PACKAGING
    CARLSON, RO
    EICHELBERGER, CW
    WOJNAROWSKI, RJ
    KOHL, JE
    MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 339 - 344
  • [39] New PCB technologies emerge for high-density interconnect
    Cookson Electronics, Providence, United States
    Electron Packag Prod, 4 (75-76, 78):
  • [40] EUROCARD DESIGN PROVIDES HIGH-DENSITY INTERCONNECT STANDARD
    WEGHORN, F
    ELECTRONIC PRODUCTS MAGAZINE, 1983, 25 (10): : 73 - 75