Cross section changing growth phenomenon of Sn whisker in Sn-3.8Ag-0.7Cu-1.0Er lead-free solder

被引：0

作者：

Hao, Hu ^{[1
]}

Shi, Yaowu ^{[1
]}

Xia, Zhidong ^{[1
]}

Lei, Yongping ^{[1
]}

Guo, Fu ^{[1
]}

Li, Xiaoyan ^{[1
]}

机构：

[1] Institute of Advanced Materials Processing Technology, School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

来源：

Jinshu Xuebao/ Acta Metallurgica Sinica | 2009年 / 45卷 / 02期

关键词：

Oxidation - Erbium alloys - Silver alloys - Tin alloys - Binary alloys - Strain energy - Crystal whiskers - Ternary alloys - Copper alloys;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Large sized ErSn3 particles precipitated in the Sn-3.8Ag-0.7Cu-1.0Er solder alloy are oxidized when exposed in air, and it was found that Sn whiskers can rapidly grow on the oxidized ErSn3. During aging at room temperature, a few rod-like Sn whiskers were observed and their diameter could be gradually changed. During aging at 150C, a great number of needle-like Sn whiskers were observed and their diameter could be also changed step by step. A model, in which the volume strain energy is not a constant during oxidation of ErSn3, was suggested to explain the observed results.

引用

页码：199 / 203