Numerical and experimental study on manifold-distributed jet microchannel with micro-pin-fins

Traditional parallel microchannels are inadequate for managing the thermal requirements of newer, large-area and high-heat-flux chips. This inadequacy arises from its high flow resistance and poor temperature uniformity. Therefore, A novel manifold microchannel heat sink combining manifold inlet/outlet structures, distributed array jets, and micro pin-fins is introduced. Numerical simulations and experimental methods were employed to investigate the flow and heat transfer performance of the heat sink. Experimental results show that, with an average heat flux density exceeding 330 W/cm2 and a total power of 2500 W, the average chip temperature remains below 70 degrees C, ensuring efficient heat dissipation. Secondary impingement occurs at sufficiently low jet chamber heights, resulting in an increase of 3 times in the average Nusselt number for a smooth base plate. For the micro-pin-finned surface, it is shown that the presence of micro-pin-fins is not necessarily conducive to heat transfer enhancement. A critical volume fraction of micro-pin-fins (critical fin-ratio) exists where the obstructive effect and enhancement effect balance each other out. This value is influenced by multiple parameters. Finally, a novel relationship for predicting the average Nusselt number of jet impingement was proposed, with an average absolute error of less than 15 %. This series of investigations addresses the existing gaps in research on manifold-distributed array jet heat sinks and provides a meticulous theoretical foundation for the design and optimization of heat sinks facing the high-power chips.