Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication

被引：0

作者：

Utsch D. ^{[1
]}

Sippel M. ^{[1
]}

Voigt C. ^{[1
]}

Häußler F. ^{[1
]}

Franke J. ^{[1
]}

机构：

[1] Institute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen-Nürnberg, Bavaria

来源：

Power Electronic Devices and Components | 2024年 / 8卷

关键词：

Additive manufacturing; Adhesion; Alumina; Printed electronics; Pull-off testing;

D O I：

10.1016/j.pedc.2024.100067

中图分类号：

学科分类号：

摘要：

More efficient electronic systems need more temperature-stable substrate materials and more flexible production possibilities. Ceramics such as alumina can be used for 2D and 3D base bodies, since they provide better thermal properties than their polymeric counterparts and can be additively manufactured utilizing e.g. Fused Filament Fabrication. Proper functionalization can be achieved by applying methods of printed electronics. Here, adhesion of the functional ink to a substrate is a crucial issue and especially challenging on ceramic substrates. This contribution reached a noteworthy increase in this matter, using a modified silver-based ink with piezojet-printing, while preserving very low electrical resistance after convection sintering. Adhesion is determined by pull-off testing, based on ISO 4624. By the approach shown in this work, printed ceramics could become a more viable choice for use in functional electronic systems. © 2024 The Author(s)

引用

共 44 条

[1]

Alhendi M., Et al., Printed electronics for extreme high temperature environments, Additive Manufacturing, 54, (2022)

[2]

Ankenbrand M., Et al., (2023)

[3]

Beedasy V., Smith P.J., Printed Electronics as Prepared by Inkjet Printing, Materials (Basel, Switzerland), 13, 3, (2020)

[4]

Braeuer P., Stoll T., Muckelbauer M., Hensel A., Franke J., Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, pp. 992-999, (2022)

[5]

Brinkhues S., Kanthamneni A., Brose A., Majcherek S., Schmidt B., Investigation of adhesion strength of metallization on thermoplastic and ceramic substrates, 2016 12th International Congress Molded Interconnect Devices (MID), Wuerzburg, Germany, pp. 1-6, (2016)

[6]

Busscher H.J., van Pelt A., de Boer P., de Jong H.P., Arends J., The effect of surface roughening of polymers on measured contact angles of liquids, Colloids and Surfaces, 9, 4, pp. 319-331, (1984)

[7]

Chen J., Guo Y., Wang Y., Zhang J., Li H., Feng Z., Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating, J. Mater. Chem. C, 4, 43, pp. 10240-10245, (2016)

[8]

Espera A.H., Dizon J.R.C., Chen Q., Advincula R.C., 3D-printing and advanced manufacturing for electronics, Prog Addit Manuf, 4, 3, pp. 245-267, (2019)

[9]

Franke J., Three-dimensional molded interconnect devices (3D-MID): Materials, Manufacturing, assembly, and applications for injection molded circuit carriers, (2014)

[10]

Giacomello A., Meloni S., Chinappi M., Casciola C.M., Cassie-Baxter and Wenzel states on a nanostructured surface: phase diagram, metastabilities, and transition mechanism by atomistic free energy calculations, Langmuir: the ACS journal of surfaces and colloids, 28, 29, pp. 10764-10772, (2012)

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