Study on magnetic compound fluid (MCF) polishing process using fluctuating magnetic field

被引：0
作者：
Sato, Takashi [1 ]
Wu, Yongbo [1 ]
Lin, Weimin [1 ]
Shimada, Kunio [1 ]
机构：
[1] Department of Machine Intelligence and Systems Engineering, Akita Prefectural University, Yurihonjyo-shi, Akita, 015-0055
来源：
Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B | 2009年 / 75卷 / 753期
关键词：
Fluctuating magnetic field; Magnetic compound fluid; Magnetic fluid; Polishing;
D O I：
10.1299/kikaib.75.753_1007
中图分类号：
学科分类号：
摘要：
Magnetic compound fluid (MCF) is expected for the use in the ultra-precision surface polishing process of three-dimensional shaped components. In this paper, the behavior of the MCF under fluctuating magnetic field was investigated. The MCF shows the action of high particle disposition and accumulation under fluctuating magnetic field, and generates the high restoring force compared to static magnetic field. Under fluctuating magnetic field, the polishing force of the MCF is higher whereas the shearing force is lower than that under static magnetic field. The higher magnetic pole rotation increases the restoring force, thus the compressed MCF is rapidly restored. The restoring force is increased by the larger eccentric distance of the magnet for fluctuating magnetic field. Polishing experiments using MCF were also carried out. The polishing performance of MCF under fluctuating magnetic field is improved compared to static magnetic field. The feasibility of the MCF polishing process for three dimensional shaped components was experimentally confirmed.
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页码：1007 / 1012
页数：5
相关论文
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