Design of Panel Level Package and Power and Signal Integrity Analysis

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作者：
National University Of Kaohsiung, Department Of Electrical Engineering, Taiwan [1 ]
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来源：
Int. Conf. Electron. Packag., ICEP | 2024年 / 273-274期
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Compilation and indexing terms; Copyright 2024 Elsevier Inc;
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摘要：
BGA - Electronics products - Package technologies - Panel level packaging - Performance - Power and signal integrities - Power integrity - Redistribution layers - Signal Integrity - Signal integrity analysis
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