Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection

被引：0
|
作者：
Zhang, Yan [1 ,2 ]
Liu, Johan [1 ,3 ]
Larsson, Ragnar [2 ]
Watanabe, Itsuo [4 ]
机构：
[1] Key Laboratory of Advanced Display and System Applications, Shanghai University, Ministry of Education, Shanghai 200072, China
[2] Department of Applied Mechanics, Chalmers University of Technology, SE-412 96 Gothenburg, Sweden
[3] Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Gothenburg, Sweden
[4] Advanced Interconnect Material Division, Hitachi Chemical Co., Ltd., 1150 Goshomiya, Chikusei-shi Ibaraki, 308-8524, Japan
来源：
Journal of Adhesion Science and Technology | 2008年 / 22卷 / 14期
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摘要：
Journal article (JA)
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页码：1717 / 1731
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