Application of industrial inkjet technology to packaging

被引:0
|
作者
Iti Corp., 8401 Baseline Rd., Boulder, CO 80303 [1 ]
机构
来源
Adv Packag | 2006年 / 2卷 / 14期
关键词
Packaging;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] Laser material processing: An industrial view of packaging applications
    Brannon, J
    PHOTON PROCESSING IN MICROELECTRONICS AND PHOTONICS, 2002, 4637 : 474 - 478
  • [22] NFC Technology and Augmented Reality in Smart Packaging
    Durdevic, Stefan
    Novakovic, Dragolub
    Kasikovic, Nemanja
    Zeljkovic, Zeljko
    Milic, Neda
    Vasic, Jelena
    INTERNATIONAL CIRCULAR OF GRAPHIC EDUCATION AND RESEARCH, 2018, (11): : 52 - 65
  • [23] Power Semiconductor IGBT Packaging Technology and Reliability
    Sun, Yameng
    Wang, Shizhao
    Xue, Lianghao
    Feng, Zheng
    Li, Rui
    Liu, Sheng
    2021 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA 2021), 2021, : 113 - 116
  • [24] Wafer level packaging technology for silicon resonators
    Baborowski, J.
    Pezous, A.
    Durante, G. Spinola
    James, R. Jose
    Ziltener, R.
    Muller, C.
    Dubois, M. -A.
    PROCEEDINGS OF THE EUROSENSORS XXIII CONFERENCE, 2009, 1 (01): : 1535 - +
  • [25] A Low Cost Patternable Packaging Technology for Biosensors
    Buchoux, Anthony
    Blair, Ewen O.
    Tsiamis, Andreas
    Marland, Jamie R. K.
    Smith, Stewart
    2017 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP 2017), 2017,
  • [26] Reliability aspects of packaging and integration technology for microfluidic systems
    Han, KH
    Frazier, AB
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2005, 5 (03) : 452 - 457
  • [27] MEMS sensor packaging using LTCC substrate technology
    Kopola, H
    Lenkkeri, J
    Kautio, K
    Torkkeli, A
    Rusanen, O
    Jaakola, T
    DEVICE AND PROCESS TECHNOLOGIES FOR MEMS AND MICROELECTRONICS II, 2001, 4592 : 148 - 158
  • [28] Progress in Packaging Technology of InGaAs Avalanche Photodiode Detectors
    Zhang Chenyang
    Mo Defeng
    Xu Hongyan
    Ma Yingjie
    Li Xue
    Su Wenxian
    LASER & OPTOELECTRONICS PROGRESS, 2024, 61 (09)
  • [29] Wire in composite technology provides improved protection and packaging
    不详
    AIRCRAFT ENGINEERING AND AEROSPACE TECHNOLOGY, 2006, 78 (06): : 556 - 556
  • [30] Through silicon vies (TSVs) technology for MEMS Packaging
    Pan, Kai-lin
    Liu, Jing
    Wang, Jiao-pin
    Huang, Jing
    MATERIALS PROCESSING TECHNOLOGIES, PTS 1 AND 2, 2011, 154-155 : 1695 - 1698