Liquid crystal polymer for RF MEMS packaging

被引：0

作者：

Faheem, Faheem F. ^{[1
,3
]}

Lee, Y.C. ^{[2
,4
,5
,6
]}

机构：

[1] Material Technology Group, Foster Miller, Inc., Waltham, MA 02451

[2] Department of Mechanical Engineering, University of Colorado, Campus Box 427, Boulder

[3] DARPA Center on Nanoscale Science and Technology, Integrated Micro/Nanoelectromechanical Transducers (iMINT), University of Colorado, Boulder

来源：

International Journal of Materials and Product Technology | 2009年 / 34卷 / 1-2期

关键词：

Encapsulation; Hermetic; LCP; Liquid crystal polymer; MEMS; Microelectromechanical; Packaging; Radio frequency; RF MEMS;

D O I：

10.1504/ijmpt.2009.022404

中图分类号：

学科分类号：

摘要：

We have developed a Liquid Crystal Polymer (LCP) encapsulation technology for RF MEMS. The RF MEMS devices are flip-chip interconnected on 50 ohm microstrip transmission line on an alumina substrate. After flip-chip device transfer, LCP is used to encapsulate the device on the substrate. This approach is similar to glob-top encapsulation used for low-cost microelectronic packaging. The effectiveness of LCP (Vectra A950) sealing has been demonstrated by monitoring the moisture level inside the package under a 100% RH environment. In addition, the LCP's permeabilities to helium and nitrogen were measured through a standard membrane characterisation setup. These permeabilities were proven to be in the same level as those of borosilicate glasses used for hermetic sealing at room temperature. LCP is an excellent encapsulation material for hermetic or near-hermetic packaging of RF MEMS. Copyright © 2009 Inderscience Enterprises Ltd.

引用

页码：66 / 76

页数：10

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