Liquid crystal polymer for RF MEMS packaging

被引：0
|
作者：
Faheem, Faheem F. [1 ,3 ]
Lee, Y.C. [2 ,4 ,5 ,6 ]
机构：
[1] Material Technology Group, Foster Miller, Inc., Waltham, MA 02451
[2] Department of Mechanical Engineering, University of Colorado, Campus Box 427, Boulder
[3] DARPA Center on Nanoscale Science and Technology, Integrated Micro/Nanoelectromechanical Transducers (iMINT), University of Colorado, Boulder
来源：
International Journal of Materials and Product Technology | 2009年 / 34卷 / 1-2期
关键词：
Encapsulation; Hermetic; LCP; Liquid crystal polymer; MEMS; Microelectromechanical; Packaging; Radio frequency; RF MEMS;
D O I：
10.1504/ijmpt.2009.022404
中图分类号：
学科分类号：
摘要：
We have developed a Liquid Crystal Polymer (LCP) encapsulation technology for RF MEMS. The RF MEMS devices are flip-chip interconnected on 50 ohm microstrip transmission line on an alumina substrate. After flip-chip device transfer, LCP is used to encapsulate the device on the substrate. This approach is similar to glob-top encapsulation used for low-cost microelectronic packaging. The effectiveness of LCP (Vectra A950) sealing has been demonstrated by monitoring the moisture level inside the package under a 100% RH environment. In addition, the LCP's permeabilities to helium and nitrogen were measured through a standard membrane characterisation setup. These permeabilities were proven to be in the same level as those of borosilicate glasses used for hermetic sealing at room temperature. LCP is an excellent encapsulation material for hermetic or near-hermetic packaging of RF MEMS. Copyright © 2009 Inderscience Enterprises Ltd.
引用
收藏
页码：66 / 76
页数：10
相关论文
共 50 条
  • [1] Liquid crystal polymer for RF MEMS packaging
    Faheem, Faheem F.
    Lee, Y. C.
    INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, 2009, 34 (1-2) : 66 - 76
  • [2] Low cost method for localized packaging of temperature sensitive capacitive RF MEMS switches in liquid crystal polymer
    Morton, Matthew A.
    Kingsley, Nickolas
    Papapolymerou, John
    2007 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-6, 2007, : 2066 - 2069
  • [3] Reliability of Liquid Crystal Polymer Air Cavity Packaging
    Aihara, Kunia
    Chen, Morgan Jikang
    Chen, Cheng
    Pham, Anh-Vu H.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (02): : 224 - 230
  • [4] Packaging with Liquid Crystal Polymer
    Anh-Vu Pham
    IEEE MICROWAVE MAGAZINE, 2011, 12 (05) : 83 - 91
  • [5] A Laser-Assisted Bonding Method Using a Liquid Crystal Polymer Film for MEMS and Sensor Packaging
    Jiang, Xin
    Wang, Changhai
    Liu, Wei
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (05): : 583 - 591
  • [6] RF characteristics of thin film liquid crystal polymer (LCP) packages for RF MEMS and MMIC integration
    Thompson, D
    Kingsley, N
    Wang, GA
    Papapolymerou, J
    Tentzeris, MM
    2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4, 2005, : 857 - 860
  • [7] Device-Level Vacuum Packaging for RF MEMS
    Rahman, M. Shahriar
    Chitteboyina, Murali M.
    Butler, Donald P.
    Celik-Butler, Zeynep
    Pacheco, Sergio P.
    McBean, Ronald V.
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2010, 19 (04) : 911 - 918
  • [8] Liquid crystal polymer based MEMS capacitive pressure sensor
    Palasagaram, JN
    Ramadoss, R
    SPACEBORNE SENSORS II, 2005, 5798 : 190 - 197
  • [9] Design of vertical packaging technology for RF MEMS switch
    Bansal, Deepak
    Sharma, Akshdeep
    Kaur, Maninder
    Rangra, K. J.
    16TH INTERNATIONAL WORKSHOP ON PHYSICS OF SEMICONDUCTOR DEVICES, 2012, 8549
  • [10] Recent progress in packaging of RF MEMS
    Seki, T
    2004 IEEE CSIC SYMPOSIUM, TECHNICAL DIGEST 2004: 26TH ANNIVERSARY: COMPOUNDING YOUR CHIPS IN MONTEREY, 2004, : 233 - 236
12345