Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework

被引：3
作者：
Chien, Chen-Fu [1 ,3 ,4 ]
Hu, Chih-Han [1 ,3 ]
Lin, Chi-Yung [2 ,5 ,6 ]
机构：
[1] Department of Industrial Engineering and Engineering Management, National Tsing Hua University
[2] Merck Display Technologies Ltd., Kuanyin Industrial Park, Taoyuan Hsien
[3] Department of Industrial Engineering and Engineering Management, National Tsing Hua University
来源：
International Journal of Manufacturing Technology and Management | 2008年 / 14卷 / 1-2期
关键词：
Decision analysis; Inspection frequency; Quality engineering; Risk analysis; UNISON decision; Wafer bumping;
D O I：
10.1504/IJMTM.2008.017491
中图分类号：
学科分类号：
摘要：
This study aims to develop a UNISON decision framework for analysing the inspection frequency decisions for the advanced wafer bumping process. Since the accumulated values of the wafers fabricated in wafer fabs are high, process excursion and defects in bumping will cause serious loss. Thus, it is critical to determine the inspection frequency to fulfil the requirement of mass production while ensuring the yield. For validation, an empirical study was conducted in a bumping company and the results showed practical viability of the proposed approach. Copyright © 2008 Inderscience Enterprises Ltd.
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收藏
页码：130 / 144
页数：14
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