Performance and thermal-aware steiner routing for 3-D stacked ICs

被引:0
|
作者
Pathak, Mohit [1 ]
Lim, Sung Kyu [1 ]
机构
[1] School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, United States
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:1373 / 1386
相关论文
共 50 条
  • [1] Performance and Thermal-Aware Steiner Routing for 3-D Stacked ICs
    Pathak, Mohit
    Lim, Sung Kyu
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2009, 28 (09) : 1373 - 1386
  • [2] Thermal-aware steiner routing for 3D stacked ICs
    Pathak, Mohit
    Lim, Sung Kyu
    IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2007, : 205 - 211
  • [3] Thermal-aware incremental floorplanning for 3D ICs
    Li, Xin
    Ma, Yuchun
    Hong, Xianlong
    Dong, Sheqin
    ASICON 2007: 2007 7TH INTERNATIONAL CONFERENCE ON ASIC, VOLS 1 AND 2, PROCEEDINGS, 2007, : 1092 - 1095
  • [4] Fighting Dark Silicon: Toward Realizing Efficient Thermal-Aware 3-D Stacked Multiprocessors
    Kumar, Sumeet S.
    Zjajo, Amir
    van Leuken, Rene
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2017, 25 (04) : 1549 - 1562
  • [5] Thermal-aware TSV Repair for Electromigration in 3D ICs
    Wang, Shengcheng
    Tahoori, Mehdi B.
    Chakrabarty, Krishnendu
    PROCEEDINGS OF THE 2016 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE), 2016, : 1291 - 1296
  • [6] Thermal-aware detour routing in 3D NoCs
    Mukherjee, Priyajit
    Chatterjee, Navonil
    Chattopadhyay, Santanu
    JOURNAL OF PARALLEL AND DISTRIBUTED COMPUTING, 2020, 144 : 230 - 245
  • [7] ATAR: An Adaptive Thermal-Aware Routing Algorithm for 3-D Network-on-Chip Systems
    Dash, Ranjita
    Majumdar, Amartya
    Pangracious, Vinod
    Turuk, Ashok Kumar
    Risco-Martin, Jose L.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (12): : 2122 - 2129
  • [8] The Thermal-aware Floorplanning for 3D ICs using carbon nanotube
    Shi, Shengqing
    Zhang, Xi
    Luo, Rong
    PROCEEDINGS OF THE 2010 IEEE ASIA PACIFIC CONFERENCE ON CIRCUIT AND SYSTEM (APCCAS), 2010, : 1155 - 1158
  • [9] A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory for Fixed-Outline 3-D ICs
    Guan, Wenbo
    Tang, Xiaoyan
    Lu, Hongliang
    Zhang, Yuming
    Zhang, Yimen
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2023, 31 (11) : 1639 - 1652
  • [10] P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs
    Al Saleh, Dima
    Safari, Yousef
    Amik, Fahad Rahman
    Vaisband, Boris
    2023 IEEE 36TH INTERNATIONAL SYSTEM-ON-CHIP CONFERENCE, SOCC, 2023, : 160 - 165