Molecular dynamics simulation of effect of grinding wheel stiffness on nanogrinding process

被引：4
作者：
Department of Intelligent Systems Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi 316-8511, Japan [1 ]
机构：
[1] Department of Intelligent Systems Engineering, Ibaraki University, Hitachi 316-8511
来源：
Int. J. Abras. Technol. | 2008年 / 3-4卷 / 316-326期
关键词：
Cutting; Depth of cut; Ginding wheel; MD; Molecular dynamics; Rubbing; Simulation; Spring constant; Stick-slip;
D O I：
10.1504/IJAT.2008.020565
中图分类号：
学科分类号：
摘要：
This paper intends to address an approach of Molecular Dynamics (MD) simulation to clarify the material deformation and removal mechanism between an abrasive grain and workpiece. The workpiece and the abrasive grain are assumed to consist of mono-crystalline copper and rigid diamond, respectively. In the present simulation model, influence of the stiffness of grinding wheel or polishing pad is taken into consideration. From the simulation results, relationships between material removal process and dynamics of the slip deformation, influence of the grinding wheel stiffness on the chip formation process and the actual depth of cut and so on, are clarified. These results indicate that the MD simulation has an advantage in deciding the stiffness of the tools and in estimating the actual depth of cut. © 2008, Inderscience Publishers.
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页码：316 / 326
页数：10
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