High Current, High Density Mounting, and High Heat Dissipation for Printed Circuit Boards That Support Electrification

被引:0
|
作者
机构
关键词
Compendex;
D O I
10.1541/IEEJJOURNAL.143.517
中图分类号
学科分类号
摘要
[No abstract available]
引用
收藏
页码:517 / 520
页数:3
相关论文
共 21 条
  • [1] High-Density Mounting Technologies for Printed Circuit Boards in Large-Capacity 3.5-inch HDDs
    Tokuda, Kota
    Kaji, Keiko
    Ishizaki, Kiyokazu
    2022 International Conference on Electronics Packaging, ICEP 2022, 2022, : 235 - 236
  • [2] HIGH DENSITY INTERCONNECTION USING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARDS.
    Kanamori, Takashi
    Nihei, Kohji
    Aida, Yoshimoto
    Denshi Tokyo/Electron Tokyo, 1981, (20): : 123 - 126
  • [3] Integral resistors in high frequency printed wiring boards
    Mahler, P
    MICROWAVE JOURNAL, 2000, 43 (02) : 108 - +
  • [4] PERFORMANCE OF CIRCUIT BREAKERS RELATED TO HIGH RATE OF RISE OF TRV IN HIGH-POWER, HIGH-DENSITY NETWORKS.
    Haginomori, E.
    Kobayashi, A.
    Yanabu, S.
    Murakami, Y.
    IEEE transactions on power apparatus and systems, 1985, PAS-104 (08): : 2267 - 2273
  • [5] ENCODING SCHEMES SUPPORT HIGH DENSITY DIGITAL DATA RECORDING.
    Severt, Richard H.
    Electronic Systems Technology and Design/Computer Design's, 1980, 19 (05): : 181 - 190
  • [6] Design of ± 535 kV hybrid high voltage direct current (HVDC) circuit breaker
    Liu, Chenyang
    Yao, Weizheng
    Xiang, Chuan
    Cheng, Xufeng
    Wang, Qinglong
    IET GENERATION TRANSMISSION & DISTRIBUTION, 2022, 16 (19) : 4017 - 4026
  • [7] DEVELOPMENT OF HIGH CURRENT DC CIRCUIT BREAKER FOR LARGE TOKAMAK FUSION DEVICE.
    Shimada, R.
    Kishimoto, H.
    Tani, K.
    Tamura, S.
    Yanabu, S.
    Yamashita, S.
    Ikeda, H.
    Sasaki, T.
    1978,
  • [8] HEAT AND MASS TRANSFER DURING HIGH CURRENT GLOW DISCHARGE NITRIDING.
    Marciniak, A.
    Karpinski, T.
    Industrial Heating, 1982, 69 (10): : 16 - 18
  • [9] Effect of Asymmetry of High-Frequency Loading on Fatigue and Dissipation of Energy of Heat-Resistant Alloys.
    Kuz'menko, A.
    Troyan, I.A.
    Tsimbalistyi, Ya.I.
    1600,
  • [10] Current-carrying tribological behavior of copper alloy matrix and molybdenum alloy coating at high current density
    Zhou, Yu-jie
    Li, Yang
    Tan, Na
    Lu, Bing-wen
    Yin, Wei
    Zhang, Guo-liang
    Liu, Meng
    Cai, Yu-Jun
    Deng, Qi-yao
    Kong, Xu
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2024, 42 (02):