Enhanced capillary pumping performance of flexible heat pipe device with multi cross-section ultra-thin wick

被引:2
作者
Cui, Jiarong [1 ,2 ,3 ]
Xu, Wenjun [1 ,2 ,3 ]
Hu, Zhanpeng [1 ,2 ,3 ]
Jiang, Xiyang [1 ,2 ,3 ]
Ling, Weisong [1 ,2 ,3 ]
Zhou, Wei [1 ,2 ,3 ]
机构
[1] Xiamen Univ, Pen Tung Sah Inst Micronano Sci & Technol, Xiamen 361005, Peoples R China
[2] Xiamen Univ, Dept Mech & Elect Engn, Xiamen 361005, Peoples R China
[3] Xiamen Inst Technol, Higher Educ Key Lab Flexible Mfg Equipment Integra, Xiamen, Peoples R China
基金
中国国家自然科学基金;
关键词
Flexible heat pipe; Capillary pumping performance; Analytical solution; Multi cross-section wick; FABRICATION; OXYGENATOR; SIMULATION; FLUID;
D O I
10.1016/j.icheatmasstransfer.2024.108405
中图分类号
O414.1 [热力学];
学科分类号
摘要
Copper mesh, with its excellent flexibility and thermal conductivity, is an ideal material for the wick of flexible heat pipe. In this paper, a structure optimization strategy of wick with multi cross-section is proposed to enhance its capillary pumping performance. The analytical solution models of single-section and multi cross-section wicks are established by the kinetic equation of capillary pumping. Numerical simulation is used to analyze the capillary pumping performance of the multi cross-section wicks, and the results confirm the multi cross-section enhancement mechanism with the infrared experimental results. Laser processing, sintering and molding, and super-hydrophilic modification are used to fabricate the multi cross-section wick. Laser removal of rectangular units can modulate the capillary pumping performance of the multi cross-section wick. The capillary height h of the multi cross-section wick is enhanced by 13.4 % when the size of the rectangular unit l x w = 40 mm x 1.5 mm and the number of removals N = 5. Compared with the heat transfer performance of the single cross-section flexible heat pipe, the evaporator temperature T and thermal resistance R of the multi cross-section flexible heat pipe decreased by 16.6 % and 77.4 %, respectively. The effective thermal conductivity Keff reaches 10,560 W/ (m & sdot;K), which is 26 times higher than that of copper.
引用
收藏
页数:15
相关论文
共 19 条
  • [1] Capillary performance analysis of copper powder-fiber composite wick for ultra-thin heat pipe
    Niu, Junyi
    Xie, Ning
    Gao, Xuenong
    Fang, Yutang
    Zhang, Zhengguo
    HEAT AND MASS TRANSFER, 2021, 57 (06) : 949 - 960
  • [2] Research on heat transfer performance of spiral woven wire mesh composite capillary wick ultra-thin heat pipe
    Chen, Qi
    Li, Jinwang
    Cong, Tianshu
    APPLIED THERMAL ENGINEERING, 2025, 262
  • [3] Thermal performance of an ultra-thin flat heat pipe with striped super-hydrophilic wick structure
    Cui, Zhuo
    Jia, Li
    Wang, Zhou
    Dang, Chao
    Yin, Liaofei
    APPLIED THERMAL ENGINEERING, 2022, 208
  • [4] Bending the heat: Innovative ultra-thin flexible loop heat pipes for enhanced mobile device cooling
    Cui, Qingjie
    Ma, Xiang
    You, Ziyi
    Yang, Xiaoping
    Zhang, Yonghai
    Wei, Jinjia
    ENERGY CONVERSION AND MANAGEMENT, 2025, 325
  • [5] Experimental study on the heat transfer performance of ultra-thin flattened heat pipe with hybrid spiral woven mesh wick structure
    Zhou, Wenjie
    Li, Yong
    Chen, Zhaoshu
    Deng, Liqiang
    Li, Bo
    APPLIED THERMAL ENGINEERING, 2020, 170
  • [6] PREPARATION METHOD AND THERMAL PERFORMANCE OF A NEW ULTRA-THIN FLEXIBLE FLAT PLATE HEAT PIPE
    Zhang, Xuancong
    Li, Jinwang
    Chen, Qi
    HEAT TRANSFER RESEARCH, 2024, 55 (11) : 1 - 17
  • [7] Sensitivity Analysis and Optimization of Heat Transfer Performance of Ultra-Thin Vapor Chamber With Composite Wick
    Huang, Zhaohui
    Li, Rui
    Gan, Yunhua
    ASME JOURNAL OF HEAT AND MASS TRANSFER, 2024, 146 (08):
  • [8] A novel ultra-thin flattened heat pipe with biporous spiral woven mesh wick for cooling electronic devices
    Zhou, Wenjie
    Li, Yong
    Chen, Zhaoshu
    Deng, Liqiang
    Gan, Yunhua
    ENERGY CONVERSION AND MANAGEMENT, 2019, 180 : 769 - 783
  • [9] Numerical Simulation of Heat Transfer Performance for Ultra-Thin Flat Heat Pipe
    YAN Wentao
    YANG Xin
    LIU Tengqing
    WANG Shuangfeng
    JournalofThermalScience, 2023, 32 (02) : 643 - 649
  • [10] Numerical Simulation of Heat Transfer Performance for Ultra-Thin Flat Heat Pipe
    Yan, Wentao
    Yang, Xin
    Liu, Tengqing
    Wang, Shuangfeng
    JOURNAL OF THERMAL SCIENCE, 2023, 32 (02) : 643 - 649