Bisphenol-A epoxy resin with excellent breakdown strength and competitive glass transition temperature

被引:3
作者
Li, Mingru [1 ]
Zhou, Bin [1 ]
Shang, Kai [1 ]
Niu, Huan [1 ]
Zhao, Jiuhui [1 ]
Jiang, Liuhao [1 ]
Li, Jiacai [1 ]
Feng, Yang [1 ]
Li, Shengtao [1 ]
机构
[1] Xi An Jiao Tong Univ, State Key Lab Elect Insulat & Power Equipment, Xian 710049, Shaanxi, Peoples R China
关键词
Epoxy resin; DC dielectric strength; Glass transition temperature; Molecule design; Crosslinked structure; COMPOSITES; DIELECTRICS;
D O I
10.1016/j.ces.2024.120979
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
In this research, we optimized both the molecular and crosslinked structures of epoxy resin to achieve exceptional breakdown strength and a competitive glass transition temperature (Tg). Through simulations, we found that the epoxy molecule with a polymerization degree of 0 (Ep0) exhibited a wider bandgap (Eg) and developed a dense crosslinked structure with higher density after crosslinking. This countered the negative impact of a reduced benzene structure, enhancing molecular rigidity and improving Tg. We isolated Ep0 components and prepared samples demonstrating a significant 22.18 % increase in breakdown strength (366.39 kV/mm vs. 299.87 kV/mm for commercial EP) and a Tg of 140.91 degrees C. The superior insulation properties of our product stem from its higher Eg molecular structure, while the competitive Tg is attributed to its compact crosslinked structure and increased density.
引用
收藏
页数:7
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