Influence of grain size and grain edge phase on the flexural strength of aluminum nitride ceramics with Y2O3 sintering additive

被引:2
作者
Zhang, Zhirui [1 ]
Wu, Haoyang [1 ,2 ]
Li, Tao [1 ]
Zhang, Zepeng [1 ]
Li, Jiaxin [1 ]
Xu, Haifeng [1 ]
Lu, Huifeng [3 ]
He, Qing [3 ]
Gu, Siyong [4 ]
Zhang, Deyin [1 ]
Yin, Haiqing [5 ,6 ]
Chu, Aimin [7 ]
Jia, Baorui [1 ]
Qu, Xuanhui [1 ]
Qin, Mingli [1 ,2 ,5 ,8 ]
机构
[1] Univ Sci & Technol Beijing, Inst Adv Mat & Technol, Beijing 100083, Peoples R China
[2] Univ Sci & Technol Beijing, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China
[3] Xiamen Juci Technol Co Ltd, Xiamen 361100, Peoples R China
[4] Xiamen Univ Technol, Key Lab Power Met Technol & Adv Mat Xiamen, Xiamen 361024, Fujian, Peoples R China
[5] Univ Sci & Technol Beijing, Beijing Adv Innovat Ctr Mat Genome Engn, Beijing 100083, Peoples R China
[6] Univ Sci & Technol Beijing, Collaborat Innovat Ctr Steel Technol, Beijing 100083, Peoples R China
[7] Hunan Univ Sci & Technol, Sch Mat Sci & Engn, Xiangtan 411201, Peoples R China
[8] Liaoning Acad Mat, Inst Mat Intelligent Technol, Shenyang 110004, Peoples R China
关键词
Aluminum nitride; Hot-pressed sintering; Flexural strength; Thermal conductivity; Annealing; ALN CERAMICS; THERMAL-PROPERTIES; MECHANICAL-PROPERTIES; NITRATE; CONDUCTIVITY; OXIDE;
D O I
10.1016/j.ceramint.2024.08.333
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The necessity for efficient heat dissipation compels AlN packaging materials towards a thinner profile. In response to the ensuing concerns regarding the reliability of strength, the effects of the grain edge phases and grain size on flexural strength are investigated in this study. Different preparation processes, including (hotpressed sintering, pressureless sintering, and annealing) are employed to prepare AlN ceramics with different grain edge phases and grain sizes. After classifying the morphology of the grain edge phases and fitting the HallPetch relationship, it is found that the grain edge phases had a more significant influence on the flexural strength. Depending on the morphology, the negative effects can be divided into three degrees. While the finer grain size proves advantageous for the flexural strength. Consequently, in the non-additive system, the flexural strength of AlN ceramic is 422 MPa, with an average grain size of 8.47 mu m. For the additive-doped system, the maximum flexural strength can reach 532 MPa, which can be attributed to the limited average grain size resulting from the hot-pressed sintering process, approximately 1.32 mu m. These results could potentially be employed in the microstructural design of high-strength AlN ceramics.
引用
收藏
页码:44957 / 44964
页数:8
相关论文
共 37 条
[1]   Effects of isothermal annealing on the oxidation behavior, mechanical and thermal properties of AlN ceramics [J].
Cao, Changwei ;
Feng, Yongbao ;
Qiu, Tai ;
Yang, Jian ;
Li, Xiaoyun ;
Liang, Tian ;
Li, Jun .
CERAMICS INTERNATIONAL, 2017, 43 (12) :9334-9342
[2]   Graphene-Carbon-Metal Composite Film for a Flexible Heat Sink [J].
Cho, Hyunjin ;
Rho, Hokyun ;
Kim, Jun Hee ;
Chae, Su-Hyeong ;
Thang Viet Pham ;
Seo, Tae Hoon ;
Kim, Hak Yong ;
Ha, Jun-Seok ;
Kim, Hwan Chul ;
Lee, Sang Hyun ;
Kim, Myung Jong .
ACS APPLIED MATERIALS & INTERFACES, 2017, 9 (46) :40801-40809
[3]   The 3.4 GHz BAW RF Filter Based on Single Crystal AlN Resonator for 5G Application [J].
Ding, Rui ;
Xuan, Weipeng ;
Dong, Shurong ;
Zhang, Biao ;
Gao, Feng ;
Liu, Gang ;
Zhang, Zichao ;
Jin, Hao ;
Luo, Jikui .
NANOMATERIALS, 2022, 12 (17)
[4]   Structure and properties of AlN ceramics prepared with spark plasma sintering of ultra-fine powders [J].
Du, Xueli ;
Qin, Mingli ;
Rauf, Abdur ;
Yuan, Zhihao ;
Yang, Baohe ;
Qu, Xuanhui .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 496 (1-2) :269-272
[5]   Double-sided cooling for high power IGBT modules using flip chip technology [J].
Gillot, C ;
Schaeffer, C ;
Massit, C ;
Meysenc, L .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (04) :698-704
[6]   Thermal management and structural parameters optimization of MCM-BGA 3D package model [J].
Gong, Liang ;
Xu, Yu-Peng ;
Ding, Bin ;
Zhang, Zhi-Hao ;
Huang, Zhao-Qin .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2020, 147
[7]   Control method to coordinate inverters and batteries for power ramp-rate control in large PV plants: Minimizing energy losses and battery charging stress [J].
Gonzalez-Moreno, A. ;
Marcos, J. ;
de la Parra, I. ;
Marroyo, L. .
JOURNAL OF ENERGY STORAGE, 2023, 72
[8]   Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons [J].
Hao, Xu ;
Wan, Shiqin ;
Zhao, Zheng ;
Zhu, Lifeng ;
Peng, Dongyao ;
Yue, Ming ;
Kuang, Jianlei ;
Cao, Wenbin ;
Liu, Guanghua ;
Wang, Qi .
ACS APPLIED MATERIALS & INTERFACES, 2023, 15 (01) :2124-2133
[9]   Enhanced mechanical properties of aluminum nitride-yttria ceramics through grain refinement by pressure assisted two-step sintering [J].
Hassan, Nafees ;
Lee, Juyeong ;
Kim, Minsoo ;
Kim, Unseo ;
Kim, Minwook ;
Moon, Seunghwan ;
Raju, Kati ;
Ahn, Byeongho ;
Choi, In-chul ;
Ryu, Sung-Soo ;
Cho, Jaehun .
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2024, 44 (02) :831-840
[10]   Investigation of cooling capability of ceramic substrates for power electronics applications [J].
Hlina, Jiri ;
Reboun, Jan ;
Janda, Martin .
APPLIED THERMAL ENGINEERING, 2024, 247