Relations between the chemical composition of Sn finish and Sn whisker growth under temperature cycling

被引:0
|
作者
Zhang, Jinsong [1 ]
Zhu, Yuchun [1 ]
Li, Juanjuan [1 ]
Wu, Yiping [1 ,2 ]
机构
[1] State Key Laboratory of Material Processing and Die and Mould Technology, Huazhong Univ. of Sci. and Technol., Wuhan 430074, China
[2] Wuhan National Laboratory for Optoelectronics, Wuhan 430074, China
来源
Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition) | 2008年 / 36卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:24 / 27
相关论文
共 50 条
  • [21] Plastic Deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag Solders
    Kang, Sung K.
    Chang, Jaewon
    Lee, Jae-Ho
    Kim, Keun-Soo
    Lee, Hyuck Mo
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1018 - 1023
  • [22] Sn Whisker Growth Mitigation by Modifying the Composition of the Solder Alloys: A Brief Review
    Choi, Halim
    Illes, Balazs
    Dusek, Karel
    MATERIALS, 2025, 18 (05)
  • [23] Transmission Electron Microscopy of Spontaneous Tin (Sn) Whisker Growth under High Temperature/Humidity Storage
    Sosiati, H.
    Hirokado, N.
    Kuwano, N.
    Ohno, Y.
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 1054 - +
  • [24] Optimum Thickness of Sn Film for Whisker Growth
    Jing Cheng
    Fuqian Yang
    Paul T. Vianco
    Bei Zhang
    James C.M. Li
    Journal of Electronic Materials, 2011, 40 : 2069 - 2075
  • [25] Stress analysis of spontaneous Sn whisker growth
    K. N. Tu
    Chih Chen
    Albert T. Wu
    Journal of Materials Science: Materials in Electronics, 2007, 18 : 269 - 281
  • [26] Sn corrosion and its influence on whisker growth
    Osenbach, J. W.
    DeLucca, J. M.
    Potteiger, B. D.
    Amin, A.
    Shook, R. L.
    Baiocchi, F. A.
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (01): : 23 - 35
  • [27] Whisker Growth From Sn Solder Alloys
    Crandall, E. R.
    Flowers, G. T.
    Lan, P.
    Bozack, M. J.
    PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 671 - 675
  • [28] Tin whisker growth on electroplated Sn multilayers
    Ting Liu
    Dongyan Ding
    Yu Hu
    Yihua Gong
    Journal of Materials Science: Materials in Electronics, 2015, 26 : 6411 - 6418
  • [29] Tin Whisker Growth on Electroplating Sn Bilayer
    Liu, Ting
    Ding, Dongyan
    Hu, Yu
    Gong, Yihua
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 931 - +
  • [30] Tin whisker growth on electroplated Sn multilayers
    Liu, Ting
    Ding, Dongyan
    Hu, Yu
    Gong, Yihua
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (09) : 6411 - 6418