Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies

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机构：
[1] Ho, Cheng-Ying
[2] Tsai, Meng-Ting
[3] Duh, Jenq-Gong
[4] 2,Lee, Jyh-Wei
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Duh, J.-G. (jgd@mx.nthu.edu.tw) | 1600年 / Elsevier Ltd卷 / 600期
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Microstructure;
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Journal article (JA)
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