Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies

被引：0
|
作者：
机构：
[1] Ho, Cheng-Ying
[2] Tsai, Meng-Ting
[3] Duh, Jenq-Gong
[4] 2,Lee, Jyh-Wei
来源：
Duh, J.-G. (jgd@mx.nthu.edu.tw) | 1600年 / Elsevier Ltd卷 / 600期
关键词：
Microstructure;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
相关论文
共 50 条
  • [1] Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies
    Ho, Cheng-Ying
    Tsai, Meng-Ting
    Duh, Jenq-Gong
    Lee, Jyh-Wei
    JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 600 : 199 - 203
  • [2] Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging
    Xia, YH
    Xie, XM
    Lu, CY
    Chang, JL
    JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 417 (1-2) : 143 - 149
  • [3] Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging
    Xia, Yanghua
    Xie, Xiaoming
    Lu, Chuanyan
    Chang, Junling
    Journal of Alloys and Compounds, 2006, 417 (1-2): : 143 - 149
  • [4] Interfacial Reaction and Failure Mechanism for SnAgCu Solder Bump with Ni(V)/Cu Under Bump Metallization During Aging
    Wang, Kai Jheng
    Duh, Jenq Gong
    2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 873 - 877
  • [5] Morphological and Microstructural Evolution of Sn-patch in SnAgCu Solder with Ni(V)/Cu under Bump Metallization
    Wang, Kai-Jheng
    Duh, Jenq-Gong
    Tsai, Su-Yueh
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 482 - +
  • [6] Influence of phosphorus on reliability of interface between Au/Ni/Cu pad and SnAgCu solder joint
    Lu, Yudong
    He, Xiaoqi
    En, Yunfei
    Wang, Xin
    Zhuang, Zhiqiang
    Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2009, 38 (03): : 477 - 480
  • [7] Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
    Lu Yudong
    He Xiaoqi
    En Yunfei
    Wang Xin
    Zhuang Zhiqiang
    RARE METAL MATERIALS AND ENGINEERING, 2009, 38 (03) : 477 - 480
  • [8] Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
    Cheng, Hsi-Kuei
    Huang, Chin-Wen
    Lee, Hsuan
    Wang, Ying-Lang
    Liu, Tzeng-Feng
    Chen, Chih-Ming
    JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 622 : 529 - 534
  • [9] Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization
    Wang K.-J.
    Tsai Y.-Z.
    Duh J.-G.
    Shih T.-Y.
    Journal of Materials Research, 2009, 24 (8) : 2638 - 2643
  • [10] Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization
    Wang, Kai-Jheng
    Tsai, Yan-Zuo
    Duh, Jenq-Gong
    Shih, Toung-Yi
    JOURNAL OF MATERIALS RESEARCH, 2009, 24 (08) : 2638 - 2643
12345