Convective heat transfer of microchannel heat sinks with pinfins and jets for a heat flux up to 500 W/cm2

被引:0
|
作者
Zhang, Xue [1 ]
Jin, Puhang [2 ]
Xie, Gongnan [1 ,2 ]
机构
[1] Northwestern Polytech Univ, Sch Marine Sci & Technol, Xian 710072, Peoples R China
[2] Northwestern Polytech Univ, Ocean Inst, Taicang 215400, Peoples R China
关键词
Microchannel heat sinks; Jet impingement; Pinfins; Thermal performance; Entropy generation; ELECTRONICS;
D O I
10.1016/j.icheatmasstransfer.2024.108381
中图分类号
O414.1 [热力学];
学科分类号
摘要
This study proposes a kind of jet impingement microchannel heat sink with pinfins and then investigates the effects of jets arragement, pinfins placement angle, and pinfins shape on the flow characteristics and heat transfer of various heat sinks. It is found that the arrangement of jets has a minor influence on the flow pressure drop but has a significant influence on the heat transfer. Considering the heat transfer coefficient and pressure drop, the 5 x 6 array jet heat sink performs the best. The shape and placement angle of pinfins greatly affect the flow characteristics and heat transfer. Elliptical fins have a more advantageous influence on the overall performance of the heat sink compared with rectangular fins. The angle of the elliptical fins corresponding to maximum thermal performance factor value decreases with Reynolds number, the trend not seen in rectangular fins. The maximum thermal performance factor of heat sink, with rectangular fins at the angle of 15 degrees is increase by 6.73 %, and it is increased by 7.86 % for the case with elliptical fins at the angle of 30 degrees. The numerical simulations of the present design are justified by the analysis from the perspectives of entropy generation and Field Synergy Principle.
引用
收藏
页数:14
相关论文
共 50 条
  • [21] Flow dynamics and heat transfer in partially porous microchannel heat sinks
    Zargartalebi, Mohammad
    Azaiez, Jalel
    JOURNAL OF FLUID MECHANICS, 2019, 875 : 1035 - 1057
  • [22] Heat transfer enhancement by silver nanowire suspensions in microchannel heat sinks
    Simsek, Eylul
    Coskun, Sahin
    Okutucu-Ozyurt, Tuba
    Unalan, Husnu Emrah
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2018, 123 : 1 - 13
  • [23] HEAT TRANSFER CHARACTERISTICS AND COOLING PERFORMANCE OF MICROCHANNEL HEAT SINKS WITH NANOFLUIDS
    Chen, Chien-Hsin
    Ding, Chang-Yi
    ICNMM 2009, PTS A-B, 2009, : 521 - 527
  • [24] A Study of Critical Heat Flux during Flow Boiling in Microchannel Heat Sinks
    Chen, Tailian
    Garimella, Suresh V.
    PROCEEDINGS OF THE ASME/JSME 8TH THERMAL ENGINEERING JOINT CONFERENCE 2011, VOL 1 PTS A AND B, 2011, : 1551 - +
  • [25] A Study of Critical Heat Flux During Flow Boiling in Microchannel Heat Sinks
    Chen, Tailian
    Garimella, Suresh V.
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2012, 134 (01):
  • [26] Packaging and performance of high power semiconductor lasers of high heat flux up to 2000 W/cm2
    Liu, XS
    Hughes, LC
    Rasmussen, MH
    Hu, MH
    Bhagavatula, VA
    Davis, RW
    Caneau, CG
    Bhat, R
    Zah, CE
    55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 251 - 258
  • [27] The characteristics of convective heat transfer in microchannel heat sinks using Al2O3 and TiO2 nanofluids
    Xia, G. D.
    Liu, R.
    Wang, J.
    Du, M.
    INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2016, 76 : 256 - 264
  • [28] Heat Flux Vector Potential in Convective Heat Transfer
    Vadasz, Peter
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2018, 140 (05):
  • [29] Convective Heat Transfer Measurements of Die-Casting Heat Sinks
    Jou, Rong-Yuan
    ADVANCED DESIGN AND MANUFACTURE II, 2010, 419-420 : 345 - 348
  • [30] Microchannel Cooling Strategies for High Heat Flux (1 kW/cm2) Power Electronic Applications
    Jung, Ki Wook
    Kharangate, Chirag R.
    Lee, Hyoungsoon
    Palko, James
    Zhou, Feng
    Asheghi, Mehdi
    Dede, Ercan M.
    Goodson, Kenneth E.
    PROCEEDINGS OF THE SIXTEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 2017, : 98 - 104