A novel cumulative fatigue damage model for electronically-conductive adhesive joints under variable loading

被引：0

作者：

Gomatam, Rajesh R. ^{[1
]}

Sancaktar, Erol ^{[2
]}

机构：

[1] Materials and Manufacturing Laboratory, Department of Mechanical Engineering, and Mechanics, Lehigh University, Bethlehem, PA 18015, United States

[2] Department of Polymer Engineering, University of Akron, Akron, OH 44325-0301, United States

来源：

Journal of Adhesion Science and Technology | 2006年 / 20卷 / 01期

关键词：

29;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Journal article (JA)

引用

页码：69 / 86