Mechanical behavior of IMC in BGA soldered joints by nanoindentation method

被引：0

作者：

Wang, Lifeng ^{[1
]}

Dai, Wenqin ^{[1
]}

Zhang, Pule ^{[1
]}

Meng, Gongge ^{[1
]}

机构：

[1] College of Materials Science and Engineering, Harbin University of Science and Technology, Harbin,150040, China

来源：

Hanjie Xuebao/Transactions of the China Welding Institution | 2014年 / 35卷 / 09期

关键词：

Soldered joints - Tin alloys - Copper alloys - Ball grid arrays - Loading - Elastic moduli - Hardness - Binary alloys - Lead-free solders - Nanoindentation;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Nanoindentation experiments were carried out on (Cu,Ni)6Sn5, Cu6Sn5 and Cu3Sn IMCs in BGA soldered joints. The influence of loading velocity on the mechanical behavior of intermetallic compounds was investigated. The Young's modulus and nanoindentation hardness of (Cu,Ni)6Sn5, Cu6Sn5 and Cu3Sn IMCs were obtained from load-depth curves with Oliver-Pharr method. The results indicate that serrated rheological effect was related to the load rate. All of three kinds of IMC, including Cu6Sn5, Cu3Sn and(Cu,Ni)6Sn5, showed serrated rheological effect with different degrees when the loading rate was low. However, the serrated rheological effect was not obvious for Cu3Sn and (Cu,Ni)6Sn5, except for Cu6Sn5, when the loading rate increased. The Young's modulus of (Cu,Ni)6Sn5, Cu6Sn5 and Cu3Sn IMCs were 126 GPa, 118 and 135 GPa, respectively. The nanoindentation hardness of (Cu,Ni)6Sn5, Cu6Sn5 and Cu3Sn IMCs were 6.5, 6.3 and 5.8 GPa, respectively. The Young's modulus and nanoindentation hardness of (Cu,Ni)6Sn5 were higher than those of Cu6Sn5.

引用

页码：11 / 14