Superior role of V2O5 and yttrium interface layers in enhancing MIS radical photodiode performance

被引:9
作者
Akila, T. [1 ]
Balasubramani, V. [1 ]
Ali, Syed Kashif [2 ,3 ]
Manthrammel, M. Aslam [4 ]
Shkir, Mohd [4 ]
Matheswaran, Priyadharshini [5 ]
机构
[1] Saveetha Univ, Saveetha Inst Med & Tech Sci, Saveetha Sch Engn, Dept Phys, Chennai 602105, Tamil Nadu, India
[2] Jazan Univ, Coll Sci, Dept Phys Sci, Chem Div, POB 114, Jazan 45142, Saudi Arabia
[3] Jazan Univ, Coll Sci, Nanotechnol Res Unit, POB 114, Jazan 45142, Saudi Arabia
[4] King Khalid Univ, Coll Sci, Dept Phys, Abha 61413, Saudi Arabia
[5] Vel Tech Rangarajan Dr Sagunthala R&D Inst Sci & T, Dept Phys, Chennai 600062, India
关键词
Schottky barrier diode; Electrical parameters; Interfacial layer; MIS; Sol-gel spin coating; Optoelectronic applications; SCHOTTKY-BARRIER DIODES; CURRENT TRANSPORT MECHANISM; VOLTAGE I-V; THIN-FILMS; ELECTRICAL-PROPERTIES; SUBSTRATE-TEMPERATURE; CAPACITANCE-VOLTAGE; THERMAL-STABILITY; HEIGHT; PHOTODETECTOR;
D O I
10.1016/j.optmat.2024.116178
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study, Cu/n-Si Schottky diodes with V2O5-Y insulating interface layer were designed for the fabrication of metal/insulator/semiconductor (MIS) structures. The effects of different Y-V2O5 interface layers placed between metals and semiconductors on the critical electrical parameters of Schottky diodes were examined. Electrical parameters of the prepared sample such as barrier height (Phi B), ideality factor (n), photosensitivity (Ps), photosensitivity (R), quantum efficiency (QE) and detectivity (D*) were obtained from the expression. Characteristics of I-V The modification in these parameters can be attributed to the use of Schottky diodes as intermediate layers. Additionally, n, Phi B values were calculated using the thermionic emission process and the photodiode parameters Ps, R, QE and D* the results were compared with each other. Experiments have shown that the Schottky structure with V2O5-Y interlayer leads to higher values of Ps = 799.70 % and under the light condition of 6 wt% of Y lower value n = 2.01. This provides evidence of the improved performance of MIS models.
引用
收藏
页数:12
相关论文
共 99 条
[1]   Atomic Layer Deposition of Gd-Doped HfO2 Thin Films [J].
Adelmann, C. ;
Tielens, H. ;
Dewulf, D. ;
Hardy, A. ;
Pierreux, D. ;
Swerts, J. ;
Rosseel, E. ;
Shi, X. ;
Van Bael, M. K. ;
Kittl, J. A. ;
Van Elshocht, S. .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (04) :G105-G110
[2]   Effect of (Ce, Al) co-doped ZnO thin films on the Schottky diode properties fabricated using the sol-gel spin coating [J].
Ahmed, M. A. M. ;
Meyer, W. E. ;
Nel, J. M. .
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 103
[3]  
Al-Rasoul K. T., 2014, Int. J. Sci. Technol. Res, V3, P213
[4]   Analysis of temperature dependent current-conduction mechanisms in Au/TiO2/n-4H-SiC (metal/insulator/semiconductor) type Schottky barrier diodes [J].
Alialy, S. ;
Altindal, S. ;
Tanrikulu, E. E. ;
Yildiz, D. E. .
JOURNAL OF APPLIED PHYSICS, 2014, 116 (08)
[5]   The barrier height distribution in identically prepared Al/p-Si Schottky diodes with the native interfacial insulator layer (SiO2) [J].
Altindal, S. ;
Kanbur, H. ;
Tataroglu, A. ;
Buelbuel, M. M. .
PHYSICA B-CONDENSED MATTER, 2007, 399 (02) :146-154
[6]  
Altindal S, 2012, J OPTOELECTRON ADV M, V14, P998
[7]   Thermally activated band conduction and variable range hopping conduction in Cu2ZnSnS4 thin films [J].
Ansari, Mohd Zubair ;
Khare, Neeraj .
JOURNAL OF APPLIED PHYSICS, 2015, 117 (02)
[8]  
Azizian-Kalandaragh Y, 2016, OPTOELECTRON ADV MAT, V10, P201
[9]   Characterization of WMoO3 Thin Films and its n-WMoO3/p-Si Junction Diodes Via JNS Pyrolysis Technique [J].
Balaji, M. ;
Chandrasekaran, J. ;
Raja, M. .
ZEITSCHRIFT FUR PHYSIKALISCHE CHEMIE-INTERNATIONAL JOURNAL OF RESEARCH IN PHYSICAL CHEMISTRY & CHEMICAL PHYSICS, 2017, 231 (05) :1017-1037
[10]   Role of substrate temperature on MoO3 thin films by the JNS pyrolysis technique for P-N junction diode application [J].
Balaji, M. ;
Chandrasekaran, J. ;
Raja, M. .
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2016, 43 :104-113