Power Electronics Packaging Materials for High Heat Reliability

被引：0
|
作者：
Hozoji H. [1 ]
Kato F. [1 ]
Tanaka S. [1 ]
Shinkai J. [1 ]
Sato H. [1 ]
机构：
[1] Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology, Power Circuit Integration Team, AIST Tsukuba West, 16-1 Onogawa, Tsukuba, Ibaraki
来源：
Journal of Japan Institute of Electronics Packaging | 2021年 / 24卷 / 03期
关键词：
6;
D O I：
10.5104/JIEP.24.233
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：233 / 240
页数：7
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