Conductive nanomaterials for printed electronics

被引:0
|
作者
机构
[1] Kamyshny, Alexander
[2] Magdassi, Shlomo
来源
Magdassi, S. (magdassi@cc.huji.ac.il) | 1600年 / Wiley-VCH Verlag卷 / 10期
关键词
Light emission - Solar cells - Transparent electrodes - Metal nanoparticles - Metals - Current density - Nanowires - Yarn - Graphene - Metallizing - Sintering;
D O I
暂无
中图分类号
学科分类号
摘要
This is a review on recent developments in the field of conductive nanomaterials and their application in printed electronics, with particular emphasis on inkjet printing of ink formulations based on metal nanoparticles, carbon nanotubes, and graphene sheets. The review describes the basic properties of conductive nanomaterials suitable for printed electronics (metal nanoparticles, carbon nanotubes, and graphene), their stabilization in dispersions, formulations of conductive inks, and obtaining conductive patterns by using various sintering methods. Applications of conductive nanomaterials for electronic devices (transparent electrodes, metallization of solar cells, RFID antennas, TFTs, and light emitting devices) are also briefly reviewed. This review reports on recent developments in the field of conductive nanomaterials namely, metal nanoparticles and nanowires, graphene, and carbon nanotubes and their application in printed electronics. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
引用
收藏
相关论文
共 50 条
  • [31] Studies on possibilities of polymer composites with conductive nanomaterials application in wearable electronics
    Gralczyk, Kinga
    Janczak, D.
    Dybowska-Sarapuk, L.
    Lepak, S.
    Wroblewski, G.
    Jakubowska, M.
    PHOTONICS APPLICATIONS IN ASTRONOMY, COMMUNICATIONS, INDUSTRY, AND HIGH ENERGY PHYSICS EXPERIMENTS 2017, 2017, 10445
  • [32] Heterogeneous three-dimensional electronics by use of printed semiconductor nanomaterials
    Ahn, Jong-Hyun
    Kim, Hoon-Sik
    Lee, Keon Jae
    Jeon, Seokwoo
    Kang, Seong Jun
    Sun, Yugang
    Nuzzo, Ralph G.
    Rogers, John A.
    SCIENCE, 2006, 314 (5806) : 1754 - 1757
  • [33] Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics
    Zhao, Beihan
    Riso, Christopher
    Leslie, David
    Dasgupta, Abhijit
    Das, Siddhartha
    Fleischer, Jason
    Hines, Daniel
    PROCEEDINGS OF ASME 2021 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2021), 2021,
  • [34] Gravure Printing of Conductive Inks on Glass Substrates for Applications in Printed Electronics
    Hrehorova, Erika
    Rebros, Marian
    Pekarovicova, Alexandra
    Bazuin, Bradley
    Ranganathan, Amrith
    Garner, Sean
    Merz, Gary
    Tosch, John
    Boudreau, Robert
    JOURNAL OF DISPLAY TECHNOLOGY, 2011, 7 (06): : 318 - 324
  • [35] Parameters Dynamics Estimation Method for Printed Electronics Conductive Elements Layers
    Kondratov, A. P.
    Zueva, A. M.
    Nagornova, I. V.
    2017 XI INTERNATIONAL IEEE SCIENTIFIC AND TECHNICAL CONFERENCE DYNAMICS OF SYSTEMS, MECHANISMS AND MACHINES (DYNAMICS), 2017,
  • [36] Modeling of Rheological Properties of Metal Nanoparticle Conductive Inks for Printed Electronics
    Dzisah, Patrick
    Ravindra, Nuggehalli M.
    TMS 2021 150TH ANNUAL MEETING & EXHIBITION SUPPLEMENTAL PROCEEDINGS, 2021, : 964 - 979
  • [37] Optimization of Contacting Technological Process on Printed Conductive Pattern for Wearable Electronics
    Benesova, Andrea
    Hirman, Martin
    Hlina, Jiri
    Tupa, Jiri
    Steiner, Franisek
    Reboun, Jan
    2020 43RD INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2020,
  • [38] Ultrastretchable Conductive Elastomers with a Low Percolation Threshold for Printed Soft Electronics
    Sun, Hongye
    Han, Zongyou
    Willenbacher, Norbert
    ACS APPLIED MATERIALS & INTERFACES, 2019, 11 (41) : 38092 - 38102
  • [39] Soldering of Electronics Components on 3D-Printed Conductive Substrates
    Podsiadly, Bartlomiej
    Skalski, Andrzej
    Sloma, Marcin
    MATERIALS, 2021, 14 (14)
  • [40] Process Study of Laser Patterning of Different Conductive Layers for Printed Electronics
    Feng, Wenhe
    Shan, X. C.
    Lim, G. C.
    2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 654 - 657