Thermal conductivity evaluation result of automotive printed circuit board

被引：0
作者：
Toda M. [1 ]
Ozeki M. [1 ]
Shishime K. [1 ]
机构：
[1] Product Development Dept., MEIKO ELECTRONICS CO., LTD., 5-14-15, Ogami, Ayase-shi, Kanagawa
来源：
Journal of Japan Institute of Electronics Packaging | 2016年 / 19卷 / 05期
关键词：
D O I：
10.5104/jiep.19.305
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：305 / 309
页数：4
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