A novel scheme for wide bandwidth chip-to-chip communications

被引：0
|
作者：
Liu, Qing [2 ]
Fay, Patrick [2 ]
Bernstein, Gary H. [1 ,2 ]
机构：
[1] Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN 46556
[2] Center for Nano Science and Technology, Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN 46556, United States
来源：
Journal of Microelectronics and Electronic Packaging | 2007年 / 4卷 / 01期
关键词：
23;
D O I：
10.4071/1551-4897-4.1.1
中图分类号：
学科分类号：
摘要：
引用
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页码：1 / 7
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