共 3 条
- [1] Development of a freezing pin chuck for polishing (2nd Report) - Cooling characteristics of a prototype freezing pin chuck and application to polishing Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, 2016, 82 (01): : 82 - 86
- [2] Clamping characteristics of pin-type vacuum chuck (1st Report) - influence of back-surface waviness on wafer flatness Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, 1998, 64 (10): : 1517 - 1521
- [3] Development of a freezing pin chuck for polishing (1st report) - Tensile and shear stress during polishing and deformation of a large warpage wafer caused by solidification - Tensile a 1600, Japan Society for Precision Engineering (80): : 950 - 955