Rheological modeling of the tensile creep behavior of paper

被引：0

作者：

DeMaio, A. ^{[1
]}

Patterson, T. ^{[1
]}

机构：

[1] Institute of Paper Science and Technology, Georgia Institute of Technology, Atlanta, GA

来源：

Journal of Applied Polymer Science | 2007年 / 106卷 / 05期

关键词：

Paper is a networked structure of randomly bonded fibers. These fibers are composed of naturally occurring polymeric materials (cellulose; hemicelluloses; and lignin). Polymeric materials such as these exhibit viscoelastic deformation; and as a result; creep under an applied stress. A rheological model has been developed to predict the tensile creep behavior of paper under a uniaxial stress. Specifically; the focus of this model was to predict creep strain using only stress; time; and efficiency factor (effectiveness of bonding). This rheological model offers insight into creep behavior (drawing from molecular creep mechanisms) and separates total strain from creep into initial elastic; primary creep; and secondary creep components. Interfiber bonding is taken into account through the use of an efficiency factor which represents how effectively bonding is distributing load throughout the fiber network of the paper. As a result; this model makes it possible to predict the creep behavior of paper over a range of bonding levels; induced by mechanical changes in bonded area or chemical modification of specific bond strength; using creep data from paper at any single level of bonding. This utility is retained as long as the fibers and the orientation of the fibers are not changed. © 2007 Wiley Periodicals; Inc;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Journal article (JA)

引用

页码：3543 / 3554

共 50 条

[1] Rheological modeling of the tensile creep behavior of paper
DeMaio, A.
Patterson, T.
JOURNAL OF APPLIED POLYMER SCIENCE, 2007, 106 (05) : 3543 - 3554
[2] Direct observations of bonding influence on the tensile creep behavior of paper
DeMaio, Andrew
Lowe, Robert
Patterson, Timothy
Ragauskas, Art
NORDIC PULP & PAPER RESEARCH JOURNAL, 2006, 21 (03) : 297 - 302
[3] Influence of bonding on the tensile creep behavior of paper in a cyclic humidity environment
Andrew DeMaio
Timothy Patterson
Mechanics of Time-Dependent Materials, 2006, 10 : 17 - 33
[4] Influence of bonding on the tensile creep behavior of paper in a cyclic humidity environment
DeMaio, Andrew
Patterson, Timothy
MECHANICS OF TIME-DEPENDENT MATERIALS, 2006, 10 (01) : 17 - 33
[5] Tensile and Shear Creep Behavior of Structural Adhesives: Experiments and Modeling
Gilda Daissè
Bilen Emek Abali
Roman Wan-Wendner
Applied Composite Materials, 2024, 31 : 739 - 764
[6] Tensile and Shear Creep Behavior of Structural Adhesives: Experiments and Modeling
Daisse, Gilda
Abali, Bilen Emek
Wan-Wendner, Roman
APPLIED COMPOSITE MATERIALS, 2024, 31 (02) : 739 - 764
[7] Creep Behavior of a PZT Wafer Under Tensile Stress: Experiments and Modeling
Sang-Joo, Kim
Chang-Hoan, Lee
TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, 2010, 34 (01) : 61 - 65
[8] THE MECHANICS OF MOISTURE ACCELERATED TENSILE CREEP IN PAPER
HASLACH, HW
TAPPI JOURNAL, 1994, 77 (10): : 179 - 186
[9] RHEOLOGICAL BEHAVIOR OF PAPER AND PAPERBOARD
ARNHOLD, D
STEINERT, T
ZELLSTOFF UND PAPIER, 1975, 24 (10): : 290 - 298
[10] Evaluating and modeling of tensile creep rupture behavior for neat and reinforced polyamide 6.6
Abdullah O.S.
Hassan S.S.
Al-Khazraji A.N.
Materials Science Forum, 2020, 1002 : 95 - 103

← 1 2 3 4 5 →