The Si3N4/TiN Interface: 4. Si3N4/TiN(001) Grown with a -250 V Substrate Bias and Analyzed In situ using Angle-resolved X-ray Photoelectron Spectroscopy

被引:0
作者
Haasch, Richard T. [1 ]
Patscheider, Jörg [1 ,2 ]
Hellgren, Niklas [1 ,3 ]
Petrov, Ivan [1 ]
Greene, J.E. [1 ]
机构
[1] University of Illinois, Department of Materials Science, Frederick Seitz Materials Research Laboratory, Urbana, IL 61801
[2] EMPA, Laboratory for Nanoscale Materials Science, CH-8600 Dübendorf
[3] Messiah College, Department of Mathematical Sciences, Grantham, PA 17027, P.O. Box 3041, One College Avenue
来源
Surface Science Spectra | 2012年 / 19卷 / 01期
关键词
Hard coating; Magnetron sputtering; Silicon nitride; Titanium nitride; Transition metal nitride;
D O I
10.1116/11.20121004
中图分类号
学科分类号
摘要
Angle-resolved x-ray photoelectron spectroscopy (AR-XPS) was used to analyze Si3N4/TiN(001) bilayers grown by ultrahigh vacuum reactive magnetron sputter deposition onto MgO(001), with a substrate potential of -250 V, in mixed 1:1 Ar/N2 discharges maintained at a total pressure of 0.5 Pa (3.75 × 10-3 Torr). The TiN(001) films were grown at 600 °C and the 4-ML-thick Si3N4 overlayers at room temperature. AR-XPS spectra were obtained using incident monochromatic Al Kα X-radiation at 0.83401 nm. Si3N4/TiN(001) Ti 2p spectra reveal enhanced unscreened final-state satellite peaks, compared to Ti 2p spectra obtained from uncapped TiN(001), due to decreased electronic screening induced by Si3N4/TiN(001) bilayer interfacial polarization. © 2012 American Vacuum Society.
引用
收藏
页码:62 / 71
页数:9
相关论文
共 50 条
  • [21] Tribological behaviour Of Si3N4 and Si3N4-%TiN based composites and multi-layer laminates
    Hadad, M
    Blugan, G
    Kübler, J
    Rosset, E
    Rohr, L
    Michler, J
    WEAR, 2006, 260 (06) : 634 - 641
  • [22] Effect of the electrical discharge machining on strength and reliability of TiN/Si3N4 composites
    Liu, CC
    Huang, JL
    CERAMICS INTERNATIONAL, 2003, 29 (06) : 679 - 687
  • [23] Combustion synthesis of α-Si3N4 powders using in-situ nano-SiO2 coated Si and Si3N4 reactants
    Wang, Liang
    He, Gang
    Yang, Zengchao
    Zhao, Hongwei
    Zhao, Jing
    Li, Jiangtao
    CERAMICS INTERNATIONAL, 2021, 47 (04) : 4854 - 4857
  • [24] Interfacial microstructure of Si3N4/Si3N4 joint brazed using Au-Ni-V filler alloy
    Zhang, J.
    Sun, Y.
    Liu, C. F.
    Zhang, H. W.
    JOURNAL OF MATERIALS SCIENCE, 2010, 45 (08) : 2188 - 2193
  • [26] Band bending at the Si(100)-Si3N4 interface studied by photoreflectance spectroscopy
    Dev, K
    Seebauer, EG
    SURFACE SCIENCE, 2005, 583 (01) : 80 - 87
  • [27] The crystal/glass interface in doped Si3N4
    Winkelman, Graham B.
    Dwyer, Christian
    Marsh, Chris
    Hudson, Toby S.
    Nguyen-Manh, Duc
    Doblinger, Markus
    Cockayne, David J. H.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 422 (1-2): : 77 - 84
  • [28] Joining of Si3N4 to Si3N4 using rapidly-solidified CuNiTiB brazing filler foils
    Xiong, HP
    Wan, CG
    Zhou, ZF
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1998, 75 (1-3) : 137 - 142
  • [29] Microstructural and mechanical characterization of the Si3N4/Si3N4 joint brazed using Au-Ni-V filler alloys
    Zhang, J.
    Sun, Y.
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2010, 30 (03) : 751 - 757
  • [30] Epitaxial growth of β-Si3N4 by the nitridation of Si with adsorbed N atoms for interface reaction epitaxy of double buffer AlN(0001)/β-Si3N4/Si(111)
    Yamabe, Nobuhiko
    Yamamoto, Yuka
    Ohachi, Tadashi
    PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 8, NO 5, 2011, 8 (05): : 1552 - 1555