Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration

被引：0

作者：

Vemuri, Madhava Sarma ^{[1
]}

Tida, Umamaheswara Rao ^{[1
]}

机构：

[1] North Dakota State University, Department of Electrical and Computer Engineering, Fargo,ND,58105, United States

来源：

Proceedings - International Symposium on Quality Electronic Design, ISQED | 2023年 / 2023-April卷

关键词：

Compendex;

D O I：

24th International Symposium on Quality Electronic Design, ISQED 2023

中图分类号：

学科分类号：

摘要：

Substrates

引用