SiC high-tech ceramics — a comparison of laser processes: Optimizing laser processes for SiC ceramics: focusing on precision, efficiency, and processing quality

被引:0
作者
Rochholz, Christian [1 ]
Meudtner, Andreas [1 ]
机构
[1] LCP Laser-Cut-Processing GmbH, Heinrich-Hertz-Str. 16, Hermsdorf,07629, Germany
关键词
Carbide cutting tools - Femtosecond lasers - Grinding (machining) - Jet drilling - Laser ablation - Laser beam cutting;
D O I
10.1002/phvs.202400038
中图分类号
学科分类号
摘要
Extensive R&D applied various laser sources — from nanosecond VIS-wavelength to femtosecond IR and water-jet guided lasers — to enhance the quality and efficiency of laser structuring, fine cutting, and drilling of silicon carbide. Tests focused on surface roughness, cutting line precision, and high ablation rates. Challenges due to diverse material compositions, like diamond layers, required combined methods to develop viable approaches. To meet economic constraints, mechanical grinding was integrated with recurring laser processing. © 2024 Wiley-VCH GmbH.
引用
收藏
页码:48 / 51
相关论文
empty
未找到相关数据