Plasma-assisted atomic layer deposition of transition metals and their carbides

被引:0
作者
Guo Z. [1 ]
Wang X. [1 ]
机构
[1] School of Advanced Materials, Shenzhen Graduate School, Peking University, Shenzhen
来源
Zhongguo Kexue Jishu Kexue/Scientia Sinica Technologica | 2021年 / 51卷 / 06期
关键词
Atomic layer deposition; Carbides; Films; Plasma-assisted; Transition metals;
D O I
10.1360/SST-2020-0342
中图分类号
学科分类号
摘要
Thin films of transition metals and their carbides are widely used in the fields of microelectronics, energy, and catalysis. Plasmaassisted atomic layer deposition (P-ALD) can generate highly reactive species and is characteristic of low deposition temperature and completeness of reactions; therefore, P-ALD is an important technique to prepare continuous, conformal, high-quality nanofilms of transition metals and their carbides on complex 3D-structured substrates. This study first introduces the basic principles of the P-ALD technology. Then, it reviews the current research progress of P-ALD for transition metals and their carbides, with particular highlights on the advantages of reducing deposition temperature, shortening nucleation period, enhancing reaction activity, and improving deposition rate and film purity. Lastly, it provides perspectives on the future directions of the P-ALD technology. © 2021, Science Press. All right reserved.
引用
收藏
页码:637 / 647
页数:10
相关论文
共 70 条
[1]  
Wong H Y, Mohd Shukor N F, Amin N., Prospective development in diffusion barrier layers for copper metallization in LSI, Microelectron J, 38, pp. 777-782, (2007)
[2]  
Gao Q, Zhang W, Shi Z, Et al., Structural design and electronic modulation of transition-metal-carbide electrocatalysts toward efficient hydrogen evolution, Adv Mater, 31, (2019)
[3]  
George S M., Atomic layer deposition: An overview, Chem Rev, 110, pp. 111-131, (2010)
[4]  
Profijt H B, Potts S E, van de Sanden M C M, Et al., Plasma-assisted atomic layer deposition: Basics, opportunities, and challenges, J Vacuum Sci Tech A-Vacuum Surfs Films, 29, (2011)
[5]  
Kim H, Oh I K., Review of plasma-enhanced atomic layer deposition: Technical enabler of nanoscale device fabrication, Jpn J Appl Phys, 53, (2014)
[6]  
Knoops H C M, Faraz T, Arts K, Et al., Status and prospects of plasma-assisted atomic layer deposition, J Vacuum Sci Tech A, 37, (2019)
[7]  
Knoops H C M, Langereis E, van de Sanden M C M, Et al., Conformality of plasma-assisted ALD: Physical processes and modeling, J Electrochem Soc, 157, (2010)
[8]  
Arts K, Utriainen M, Puurunen R L, Et al., Film conformality and extracted recombination probabilities of O atoms during plasma-assisted atomic layer deposition of SiO<sub>2</sub>, TiO<sub>2</sub>, Al<sub>2</sub>O<sub>3</sub>, and HfO<sub>2</sub>, J Phys Chem C, 123, pp. 27030-27035, (2019)
[9]  
Knoops H C M, de Peuter K, Kessels W M M., Redeposition in plasma-assisted atomic layer deposition: Silicon nitride film quality ruled by the gas residence time, Appl Phys Lett, 107, (2015)
[10]  
Knisley T J, Ariyasena T C, Sajavaara T, Et al., Low temperature growth of high purity, low resistivity copper films by atomic layer deposition, Chem Mater, 23, pp. 4417-4419, (2011)