Preparation of Non-Covalent Modified Graphene and Its Thermal Conductivity of Epoxy Resin Composites

被引：0
|
作者：
Yumin D. [1 ]
Yunliang J. [1 ]
Yong X. [1 ]
Jianping Z. [1 ]
Zhiwei H. [1 ]
Hongbo L. [1 ]
机构：
[1] School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang
来源：
Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering | 2024年 / 40卷 / 03期
关键词：
composites; epoxy resin; graphene; heat conduction; polyvinylpyrrolidone;
D O I：
10.16865/j.cnki.1000-7555.2024.0052
中图分类号：
学科分类号：
摘要：
Polyvinylpyrrolidone (PVP) modified graphene (GR@PVP) was prepared by non-covalent bond surface modification. EP/GR composites with different filling amounts were obtained by blending it with epoxy resin (EP). The results of FT- IR and thermogravimetric analysis (TGA) show that polyvinylpyrrolidone was successfully grafted onto the surface of graphene. The results of DMA and TG show that the storage modulus, glass transition temperature and loss factor peak height of EP/GR@PVP composites are lower than those of EP/GR composites, indicating that polyvinylpyrrolidone enhances the flexibility of epoxy resin composites. The fracture morphology of the composites was observed by scanning electron microscopy. GR@PVP is uniformly dispersed in epoxy resin and has good compatibility with the matrix. When the filler mass fraction is 2.0%, the thermal conductivity of EP/GR@PVP composites is 205.3% and 52.6% higher than that of pure EP and EP/GR composites, respectively. The apparent viscosity of EP/GR@PVP- 2 composites at 25 ℃ (13.29 Pa · s) meets the requirement of electronic packaging materials for the processing viscosity of composites (<20 Pa · s). This paper provided a simple method for further preparation of electronic packaging materials with high thermal conductivity and low viscosity. © 2024 Sichuan University. All rights reserved.
引用
收藏
页码：143 / 152
页数：9
相关论文
共 24 条
  • [1] Chen H, Ginzburg V V, Yang J, Et al., Thermal conductivity of polymer- based composites: Fundamentals and applications, Progress in Polymer Science, 59, pp. 41-85, (2016)
  • [2] Zhang Y, Heo Y J, Son Y R, Et al., Recent advanced thermal interfacial materials: a review of conducting mechanisms and parameters of carbon materials, Carbon, 142, pp. 445-460, (2019)
  • [3] Ouyang Y, Li X, Ding F, Et al., Simultaneously enhance thermal conductive property and mechanical properties of silicon rubber composites by introducing ultrafine Al2O3 nanospheres prepared via thermal plasma, Composites Science and Technology, 190, (2020)
  • [4] Barani Z, Mohammadzadeh A, Geremew A, Et al., Thermal properties of the binary ‐ filler hybrid composites with graphene and copper nanoparticles, Advanced Functional Materials, 30, (2020)
  • [5] Shen X, Wang Z, Wu Y, Et al., Effect of functionalization on thermal conductivities of graphene/epoxy composites, Carbon, 108, pp. 412-422, (2016)
  • [6] Li X Y, Chen Z C., Preparation for thermally conductive polyurethane elastomer/graphene nanosheets composites and their properties, Polymer Materials Science & Engineering, 36, 4, pp. 156-160, (2020)
  • [7] Conrado F, Pavese M., A continuous 3D- graphene network to overcome threshold issues and contact resistance in thermally conductive graphene nanocomposites, Journal of Nanomaterials, 2017, (2017)
  • [8] Yu A, Ramesh P, Itkis M E, Et al., Graphite nanoplatelet − epoxy composite thermal interface materials, The Journal of Physical Chemistry C, 111, pp. 7565-7569, (2007)
  • [9] Li Q, Guo Y, Li W, Et al., Ultrahigh thermal conductivity of assembled aligned multilayer graphene/epoxy composite, Chemistry of Materials, 26, pp. 4459-4465, (2014)
  • [10] Sui R M, Hao Y W, Zhou Y H, Et al., Hydroxy- terminated hyperbranched poly(amine- ester)grafted with graphene oxide and its application in epoxy resin, Polymer Materials Science & Engineering, 37, 11, pp. 69-76, (2021)
123