Study on Composite Dielectric Encapsulation Materials for High Voltage Power Device Packaging

被引：0
|
作者：
Li J. [1 ]
Mei Y. [2 ]
Liang Y. [1 ]
Tang X. [3 ]
Lu G. [4 ]
机构：
[1] School of Materials Science and Engineering, Tianjin University, Tianjin
[2] School of Electrical Engineering, Tiangong University, Tianjin
[3] State Key Laboratory of Advanced Power Transmission Technology, Global Energy Interconnection Research Institute Co. Ltd, Beijing
[4] Bradley Department of Electrical and Computer Engineering, Virginia Tech University, Blacksburj, 24061, VA
来源：
Diangong Jishu Xuebao/Transactions of China Electrotechnical Society | 2022年 / 37卷 / 03期
关键词：
Conductivity nonlinearity; High-voltage insulation; Partial discharge; Power module; SiC device packaging;
D O I：
10.19595/j.cnki.1000-6753.tces.210049
中图分类号：
学科分类号：
摘要：
The packaging insulation material is the most important part in power electronic devices, because it limits the applicability of the power devices in the trend of high voltage. In this paper, silicone gel composites with nonlinear electrical conductivity were prepared by doping silicon carbide nanoparticles with the silicone gel. The effects of the filler content and operating temperature on the DC conductance of the composites were discussed experimentally. Power modules were demonstrated using the composites for further partial discharge (PD) testing. The PD initial voltage of the power modules were improved in the proposed way. The results showed that the electric field distribution can be significantly homogenized by the composite with the 60vol% filler in the power module. The partial discharge initial voltage can be increased by 42.03%. Thermal oxygen aging testing and thermal shock testing were also carried out to verify the long-term reliability of the insulation composites. © 2022, Electrical Technology Press Co. Ltd. All right reserved.
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页码：786 / 792
页数：6
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