Real-time monitoring and diagnosis of die attach structure deterioration by using acoustic emission method

被引：0

作者：

Zhang, Zheng ^{[1
]}

Suetake, Aiji ^{[1
]}

Chen, Chuantong ^{[1
]}

Katayama, Osamu ^{[2
]}

Ishino, Hiroshi ^{[2
]}

Endo, Takeshi ^{[2
]}

Sugiura, Kazuhiko ^{[2
]}

Tsuruta, Kazuhiro ^{[2
]}

Suganuma, Katsuaki ^{[1
]}

机构：

[1] Osaka University, Institute of Scientific and Industrial Research, Mihogaoka 8-1, Ibaraki, Osaka,567-0047, Japan

[2] Mirise Technologies Corporation, Power Electronics R and D Div.2, Nisshin, Aichi,470-0111, Japan

来源：

2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Acoustic emission testing - Dies - Health - Power electronics

引用

页码：91 / 92

共 3 条