Development of Photosensitive Polyimides Compositions with Low Dielectric Property Corresponding to Semiconductor Back-End Processes

被引：0
|
作者：
Yamaguchi, Takashi [1 ]
Nakamura, Taiyo [1 ]
Yamashita, Madoka [1 ]
Tazaki, Takashi [2 ]
机构：
[1] Research and Development H.Q., Arakawa Chemical, Industries, Ltd., 1-1-9, Tsurumi, Tsurumi-ku, Osaka,538-0053, Japan
[2] Fine chemicals and Electronics Div., Business H.Q., Arakawa Chemical Industries, Ltd., 1-3-7, Hiranomachi, Chuo-Ku, Osaka,541-0046, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2024年 / 27卷 / 05期
关键词：
28;
D O I：
10.5104/jiep.27.426
中图分类号：
学科分类号：
摘要：
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页码：426 / 432
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