共 50 条
[2]
Ackerman S., 2020, arXiv
[4]
Alonso V., 2019, Procedia Manuf, V41, P359, DOI [DOI 10.1016/J.PROMFG.2019.09.020, DOI 10.1016/J.PR0MFG.2019.09.020]
[5]
Ba J, 2014, ACS SYM SER
[8]
Inspection and Classification of Semiconductor Wafer Surface Defects Using CNN Deep Learning Networks
[J].
APPLIED SCIENCES-BASEL,
2020, 10 (15)
[9]
Choudhari SJ, 2022, PROCEEDINGS OF ASME 2022 17TH INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE, MSEC2022, VOL 1
[10]
A Vision-Based Human Digital Twin Modeling Approach for Adaptive Human-Robot Collaboration
[J].
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,
2023, 145 (12)