Improvement of Heat Dissipation Performance of Deep Ultraviolet LED

被引：0

作者：

Zhao, Jianguo ^{[1
]}

Yang, Jianan ^{[1
,2
]}

Xu, Ru ^{[1
]}

Li, Jiarui ^{[2
]}

Wang, Shuchang ^{[2
]}

Zhang, Huiguo ^{[2
]}

Chang, Jianhua ^{[1
]}

机构：

[1] School of Electronic and Information Engineering, Nanjing University of Information Science and Technology, Nanjing

[2] School of Electronic and Information Engineering, Changshu Institute of Technology, Suzhou

来源：

Faguang Xuebao/Chinese Journal of Luminescence | 2024年 / 45卷 / 10期

基金：

中国国家自然科学基金;

关键词：

DUV-LED; heat dissipation performance; junction temperature; thermal resistance;

D O I：

10.37188/CJL.20240173

中图分类号：

学科分类号：

摘要：

Deep ultraviolet light-emitting diodes（DUV-LEDs）can be widely used in many fields such as sterilization，biochemical detection，healthcare and UV communication. Currently，the wall-plug efficiency of commercial DUV-LEDs is usually less than 5%，which leads to serious heat generation and high junction temperature，which in turn leads to a series of problems such as peak wavelength redshift，increased light decay，and shortened lifetime of the LEDs. In the context of the difficulty of improving the wall-plug efficiency，it is necessary to improve heat dissipation performance of DUV-LEDs to reduce their operating junction temperature. Thermal resistance is a direct parameter to reflect the heat dissipation performance of LEDs，which is usually affected by factors such as thermal conductive area，material thickness，and material thermal conductivity. In this paper，the effects of chip size，solder gap filling，thermal grease application and PCB materials on the thermal resistance of DUV LEDs have been intensively studied，and the thickness of the solid crystal area and the solder layer have been simulated. It has been found that increasing the size of the LED chip，filling the gap in the solder layer，applying thermal grease and replacing the Al PCB with a Cu PCB can reduce the thermal resistance of the LED. For a commercial 20 mil×20 mil 275 nm DUV-LED，the thermal resistance was reduced from 22. 19 ℃/W to 12. 83 ℃/W，and the chip temperature rise was reduced from 14. 69 ℃ to 8. 49 ℃ when operating at 25 ℃ and 0. 662 W. The simulation results indicate that the LED working junction temperature decreases linearly with the reduction of the thickness of the solid crystal area or solder layer，in which the chip temperature increases by 44. 82 ℃ for every 1 mm increase in the thickness of the solid crystal area，so the reduction of thermal resistance can be realized by appropriately thinning the thickness of the solid crystal area. © 2024 Editorial Office of Chinese Optics. All rights reserved.

引用

页码：1707 / 1715

页数：8

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