Guest Editorial Special Section on Ultrawide/Wide Bandgap Device, Packaging, Control, EMI, and Applications for Power Electronics

被引：0

作者：

Mazumder, Sudip K. ^{[1
]}

Shen, Zheng John ^{[2
]}

Wang, Shuo ^{[3
]}

机构：

[1] Univ Illinois, Chicago, IL 60607 USA

[2] Simon Fraser Univ, Burnaby, BC V5A 1S6, Canada

[3] Univ Florida, Dept Elect & Comp Engn, Gainesville, FL 32611 USA

来源：

IEEE TRANSACTIONS ON POWER ELECTRONICS | 2024年 / 39卷 / 12期

关键词：

Special issues and sections; Wide band gap semiconductors; Semiconductor device packaging; Electromagnetic interference; Power electronics; Control systems; Photonic band gap; Semiconductor device measurement;

D O I：

10.1109/TPEL.2024.3468488

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：15693 / 15695

页数：3

共 37 条

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